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Novel packaging method capable of controlling light-emitting colors of LED (light-emitting diode) and device thereof

A new type of color technology, applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of LED heat dissipation and single color

Inactive Publication Date: 2011-08-17
北京容宝科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] The technical problem to be solved by the present invention is to provide a new packaging method and device with controllable LED light color to effectively solve the problems of LED heat dissipation and single color

Method used

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  • Novel packaging method capable of controlling light-emitting colors of LED (light-emitting diode) and device thereof
  • Novel packaging method capable of controlling light-emitting colors of LED (light-emitting diode) and device thereof
  • Novel packaging method capable of controlling light-emitting colors of LED (light-emitting diode) and device thereof

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Experimental program
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Effect test

Embodiment 1

[0036] refer to figure 1 , which shows a flow chart of a new packaging method of the present invention with controllable LED light emission color, the method includes:

[0037] Step S101, selecting a metal with a thermal conductivity greater than or equal to 80 W / m·Kelvin as the bottom plate heat sink;

[0038] Preferably, the metal of the heat sink for processing the bottom plate is silver, copper, gold, aluminum, iron, aluminum alloy or magnesium alloy.

[0039] In this embodiment, a metal processing integral bottom plate heat sink with good thermal conductivity is selected. In practice, materials with higher thermal conductivity values ​​include silver (thermal conductivity 429 watts / meter Kelvin W / m K), copper (thermal conductivity 401W / m K), gold (thermal conductivity 317W / m K), aluminum (thermal conductivity 237W / m K), iron (thermal conductivity 80W / m K). The heat conduction and heat dissipation materials widely used in LED lighting products are mainly copper and alumi...

Embodiment 2

[0065] refer to figure 2 , which shows a structural diagram of a novel packaging device with controllable LED light emission color according to the present invention, the device includes:

[0066] The first processing module 201 is used to obtain a metal with a thermal conductivity greater than or equal to 80 W / m·Kelvin as a bottom plate heat sink;

[0067] The second processing module 202 is used to process the glue dispensing frame used to divide the bottom plate heat sink into different die-bonding regions;

[0068] The third processing module 203 is used to seamlessly combine the processed glue dispensing frame with the bottom plate heat sink;

[0069] The fourth processing module 204 is used for performing die bonding and welding in different die bonding areas and applying different fluorescent glues according to preset requirements to complete the packaging of LED chips.

[0070] Preferably, the fourth processing module 204 includes one or more sub-modules, which are ...

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Abstract

The invention provides a novel packaging method capable of controlling the light-emitting colors of an LED (light-emitting diode) and a device thereof, a dispensing outer frame is arranged on a metal material with larger area and volume and good heat conduction performance (the heat conduction coefficient is larger than 80w / m.K), the dispensing outer frame is utilized for dividing a baseplate with large area into different regions for die bonding and wire welding by heat sink, and different fluorescent glues are coated and dispensed in different regions, so that different regions on a same light source can be capable of emitting different colors, and further the changes in the colors of the light source can be controlled through a circuit.

Description

technical field [0001] The invention relates to the technical field of electronic semiconductors, in particular to a novel packaging method and device with controllable color of light emitted by LEDs. Background technique [0002] LED is light-emitting diode, as a new light-emitting material, it has been widely used in decoration, lighting and other fields. Its light extraction efficiency is closely related to the packaging material, and the heat dissipation performance of the product is the most important factor determining its lifespan. [0003] When packaging white LED products, it is necessary to first solidify the LED chip and wire, and then apply yellow fluorescent glue on the outside of the chip and the soldered gold wire; in this way, when the LED chip is powered on, the blue light emitted will excite yellow fluorescence. Glue produces white light. LED chips are generally packaged in a special bracket. The bottom of the bracket is a reflective base plate for solid ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/52
Inventor 王鑫冉帅
Owner 北京容宝科技有限公司