Polishing solution heating device, polishing solution temperature control device and polishing solution conveying system

Abstract

The invention discloses a polishing solution heating device which comprises a heating container, a heating element and a polishing solution heat exchanging pipe, wherein a containing cavity is defined in the heating container; the containing cavity is internally filled with a heat exchanging solution; the heating element is arranged in the containing cavity and is used for heating the heat exchanging; the polishing solution heat exchanging pipe is provided with an inlet end and an outlet end, and is wound in the containing cavity, and the inlet end and outlet end of the polishing solution heat exchanging pipe respectively extend out of the heating container. The invention also discloses a polishing solution temperature control device comprising the polishing solution heating device and a polishing solution conveying system. Through utilizing the polishing solution temperature control device comprising the polishing solution heating device provided by the invention and the polishing solution conveying system, the polishing solution at required temperature can be provided for a chemical mechanical polishing procedure, thus the polishing effect is improved.

Description

technical field [0001] The invention relates to a polishing liquid heating device, comprising a polishing liquid temperature control device and a polishing liquid conveying system of the polishing liquid heating device. Background technique [0002] With the increasing number of wiring layers in large-scale integrated circuits, in order to ensure the effective implementation of the next process, it is necessary to planarize each layer of wiring. Chemical-mechanical polishing (CMP) is the best and only global planarization technique. During chemical mechanical polishing, firstly, the oxidizing agent and complexing agent in the polishing liquid between the surface and the polishing pad react chemically with copper, and a layer of chemical reaction film is formed on the copper surface, and then the abrasive in the polishing liquid The grain and the polishing pad made of polymer material remove this layer of chemical reaction film by mechanical action, so that the fresh surface...

AI Technical Summary

Problems solved by technology

[0003] Among them, the temperature of the polishing liquid has a great influence on the polishing effect. If the temperature is too low, the polishing rate will be too low. If the temperature is too high, the corrosion of the wiring surface will be increased.

Images