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Positioning device for electrode welding of semiconductor laser

A positioning device and laser technology, applied in auxiliary devices, welding equipment, metal processing, etc., can solve the problems of different sizes that are prone to shaking, difficult welding of heat sink electrodes, poor solder joint consistency, etc., and solve the problem of heat sink thickness. , improve the welding quality, improve the effect of yield

Inactive Publication Date: 2011-09-14
CHANGCHUN INST OF OPTICS FINE MECHANICS & PHYSICS CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to solve the problems of shaking easily during welding due to small heat sinks and difficult welding of heat sink electrodes of different sizes, the purpose of the present invention is to provide a positioning device for semiconductor laser electrode welding, which effectively solves the problems caused by the existing packaging process. Soldering short circuit, virtual soldering, poor consistency of solder joints and other problems, thereby reducing costs and improving the packaging quality of devices

Method used

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  • Positioning device for electrode welding of semiconductor laser
  • Positioning device for electrode welding of semiconductor laser

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Embodiment 1

[0019] The chassis 1, base 2, pull plate 4, handle 5, fixing bolt 7, chassis fixing screw 9, and base fixing screw 10 in the positioning device of the present invention are all made of metal materials, such as materials such as stainless steel, copper, and oxygen-free copper. The spring 8 is made of manganese steel, and the heat sink 11 is made of metal oxygen-free copper. The parallelism of the surface of the device chassis is required to be 0.6 microns, the parallelism of the bottom of the heat sink is required to be 0.5 microns, and the electrode welding temperature is 120 ° C.

[0020] The size of the heat sink groove 3 can be adjusted according to the size of the heat sink 11 , and the tension of the pull plate 4 can be adjusted according to the diameter and length of the spring 8 .

Embodiment 2

[0022] The present invention can be applied to welding devices of different chip lengths and upper and lower electrodes of high-power semiconductor lasers, only needing to adjust the size of the heat sink 3 and the heating temperature of the device.

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PUM

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Abstract

The invention relates to a positioning device for the electrode welding of a semiconductor laser, belonging to the technical field of semiconductor optoelectronics. The positioning device comprises a chassis (1), a base (2), a heat sink groove (3), a pulling plate (4), a handle (5), a pulling plate groove (6) and a spring (8), wherein the base (2) is fixed on the chassis (1) and provided with the heat sink groove (3) and the pulling plate groove (6); the heat sink groove (3) is communicated with the pulling plate groove (6); the pulling plate (4) is positioned in the pulling plate groove (6); the handle (5) is fixed on the pulling plate (4); and one end of the spring (8) is fixed on the base (2), and the other end of the spring (8) is fixed on the pulling plate (4). The invention has the advantages of simplifying the manual outer lead bonding technology, increasing the welding speed of an electrode lead of the high-power semiconductor laser, enhancing the finished product ratio of products and prolonging the service life of devices.

Description

technical field [0001] The invention belongs to the technical field of semiconductor optoelectronics, and relates to a positioning device for semiconductor laser electrode welding. Background technique [0002] At present, most domestic single-tube semiconductor laser electrodes are ordered from abroad. The purchased laser heat sink is a heat sink for solder and lead wires. It needs to be heated and burned to complete the chip, but the cost is very high. In China, the heat sink is generally placed in a through groove and the outer leads are welded with solder. During the welding process, it is very easy to have too much or too little solder, welding misalignment, etc., resulting in welding short circuit, virtual welding, etc. Phenomenon, it is easy to damage the chip, which seriously affects the stability, reliability, life and yield of high-power laser devices. Contents of the invention [0003] In order to solve the problems of shaking easily during welding due to small...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K3/08B23K3/00
Inventor 刘云王立军赵智玉秦莉宁永强单肖楠付喜宏王彪
Owner CHANGCHUN INST OF OPTICS FINE MECHANICS & PHYSICS CHINESE ACAD OF SCI
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