Positioning device for electrode welding of semiconductor laser
A positioning device and laser technology, applied in auxiliary devices, welding equipment, metal processing, etc., can solve the problems of different sizes that are prone to shaking, difficult welding of heat sink electrodes, poor solder joint consistency, etc., and solve the problem of heat sink thickness. , improve the welding quality, improve the effect of yield
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Embodiment 1
[0019] The chassis 1, base 2, pull plate 4, handle 5, fixing bolt 7, chassis fixing screw 9, and base fixing screw 10 in the positioning device of the present invention are all made of metal materials, such as materials such as stainless steel, copper, and oxygen-free copper. The spring 8 is made of manganese steel, and the heat sink 11 is made of metal oxygen-free copper. The parallelism of the surface of the device chassis is required to be 0.6 microns, the parallelism of the bottom of the heat sink is required to be 0.5 microns, and the electrode welding temperature is 120 ° C.
[0020] The size of the heat sink groove 3 can be adjusted according to the size of the heat sink 11 , and the tension of the pull plate 4 can be adjusted according to the diameter and length of the spring 8 .
Embodiment 2
[0022] The present invention can be applied to welding devices of different chip lengths and upper and lower electrodes of high-power semiconductor lasers, only needing to adjust the size of the heat sink 3 and the heating temperature of the device.
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