High-power light emitting diode (LED) liquid silicone rubber encapsulation method and encapsulation mould

Abstract

The invention discloses a high-power light emitting diode (LED) liquid silicone rubber encapsulation method and a high-power LED liquid silicone rubber encapsulation mould. The method comprises the following steps of: 1) preparing an upper mould and a lower mould, and arranging the upper mould in a working area for later use, wherein the upper mould is provided with an inwards-sunken cavity and amaterial inlet; the shape of the inwards-sunken cavity corresponds to the upper shape of a to-be-encapsulated LED bracket chip; the material inlet injects rubber into the cavity; and the lower mould is provided with a positioner of which the shape corresponds to the lower shape of a to-be-encapsulated LED bracket; 2) arranging the LED bracket into the lower mould for preheating; 3) conveying the lower mould with the LED bracket to the working area; 4) aligning the upper and lower moulds, and performing mould matching, wherein the upper mould tightly presses the LED bracket; 5) injecting the rubber into an inner cavity formed by the LED bracket and the upper mould, and performing heating baking to mold and cure the injected rubber solution; and 6) separating the upper mould from the lower mould, conveying the lower mould back into a transition area, and taking the bracket out. In the encapsulation method, a process is simple and rational, and production efficiency is high; the rubber is injected automatically uniformly at high speed, encapsulation quality is high, and curing time is short.

Description

technical field [0001] The invention relates to a high-power LED packaging technology, in particular to a high-power LED liquid silica gel packaging method and a packaging mold thereof. Background technique [0002] The packaging of existing high-power LEDs usually adopts the following two methods: [0003] The first one is to manually cover the PC lens case in the LED bracket, then inject silica gel into the vent hole of the PC lens case, then place the bracket filled with silica gel in a cool place, and let it stand for a period of time until the silica gel is formed; [0004] The second is to buckle the bracket into the mold strip, then inject the glue into the mold strip, and then bake it into shape; [0005] Although the production process of the above two packaging methods is simple and does not require too much equipment investment, it is purely manual work and the production efficiency is low. Once the PC lens case or mold strip is not tightly combined with the brac...

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Problems solved by technology

[0005] Although the production process of the above two packaging methods is simple and does not require too much equipment investment, it is purely manual work and the production efficiency is low. Once the PC lens case or mold strip is not tightly combined with the bracket, air bubbles will be generated during glue filling, which will affect the quality of the product. There is no guarantee, so that the production cost cannot be effectively reduced, which affects product promotion

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