Modular semiconductor device for strengthening heat dissipation

A semiconductor and thermal connection technology, which is applied in semiconductor devices, semiconductor/solid-state device components, electric solid-state devices, etc., can solve the problems of low heat transfer efficiency, large gas heat convection thermal resistance, and poor heat dissipation effect

Inactive Publication Date: 2011-09-28
TAIWAN MASTER HILL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the thermal resistance of gas heat convection is large, and the efficiency of heat transfer is not high, so the effect of heat dissipation is not good

Method used

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  • Modular semiconductor device for strengthening heat dissipation
  • Modular semiconductor device for strengthening heat dissipation
  • Modular semiconductor device for strengthening heat dissipation

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Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0069] In order to have a clearer understanding of the technical features, purposes and effects of the present invention, the specific implementation manners of the present invention will now be described with reference to the accompanying drawings.

[0070] figure 1 It is a structural schematic diagram of the first embodiment of the present invention. The modular semiconductor device 10 for enhanced heat dissipation includes a container 12, which has an airtight chamber 14 filled with a phase-change refrigerant, and a liquid-phase refrigerant 22 and a gas-phase refrigerant 32 in the chamber. Dynamic equilibrium is maintained in chamber 14. The liquid-phase refrigerant 22 is driven by gravity to gather at the bottom of the chamber 14 , and the gas-phase refrigerant 32 is filled in the chamber 14 . Cavity wall 16 is constructed of, for example, glass material, metallic material, or combinations thereof, and includes a penetrating surface 21 to allow radiant energy and / or light...

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Abstract

The invention discloses a modular semiconductor device for strengthening heat dissipation, which comprises a container with a cavity wall, wherein a cavity is formed in the container; the cavity wall is provided with a penetrating surface, so that radiation energy and / or light rays can penetrate the container; the container comprises an optical collecting area for converging, gathering or dispersing, and diffusing the radiation energy and / or light rays; phase-change refrigerants are filled in the cavity; an evaporator comprising a heat-conducting unit and a capillary unit is positioned in thecavity; one part of the capillary unit is contacted with the liquid-phase refrigerants; and when a semiconductor element works, the liquid-phase refrigerants are evaporated into gas-phase refrigerants by the generated heat through the evaporator and are condensed on the cavity wall, so that the heat is transferred to the cavity wall and is diffused in an ambient environment, and the refrigerants which are condensed into the liquid phase are evaporated into the gas-phase refrigerants again through the evaporator. Therefore, the phase-change cycle of the refrigerants helps the semiconductor element to diffuse the heat in the ambient environment continuously.

Description

technical field [0001] The invention relates to a heat dissipation structure, in particular to a modularized semiconductor device for enhancing heat dissipation and helping semiconductor elements to dissipate heat. Background technique [0002] When the semiconductor element is working, it needs to maintain a proper semiconductor working junction temperature range in order to maintain good performance. For example, solar cells, light-emitting diodes, and thermo-electric semiconductor elements (such as thermo-electric generators), at high semiconductor junction temperatures, will cause their work efficiency to deteriorate, and light-emitting diodes also have the problem of color drift. Especially for concentrating solar cells and high-power light-emitting diodes, the heat dissipation capability is even more important. However, for such high-power components, the known metal fin radiators not only provide limited heat dissipation capability, but also have large thermal conduc...

Claims

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Application Information

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IPC IPC(8): H01L23/427H01L23/367H01L31/052H01L33/64H01L35/30
CPCY02E10/52H01L2924/0002Y02E10/50
Inventor张丽芬郭文凯
OwnerTAIWAN MASTER HILL TECH CO LTD