Modular semiconductor device for strengthening heat dissipation
A semiconductor and thermal connection technology, which is applied in semiconductor devices, semiconductor/solid-state device components, electric solid-state devices, etc., can solve the problems of low heat transfer efficiency, large gas heat convection thermal resistance, and poor heat dissipation effect
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[0069] In order to have a clearer understanding of the technical features, purposes and effects of the present invention, the specific implementation manners of the present invention will now be described with reference to the accompanying drawings.
[0070] figure 1 It is a structural schematic diagram of the first embodiment of the present invention. The modular semiconductor device 10 for enhanced heat dissipation includes a container 12, which has an airtight chamber 14 filled with a phase-change refrigerant, and a liquid-phase refrigerant 22 and a gas-phase refrigerant 32 in the chamber. Dynamic equilibrium is maintained in chamber 14. The liquid-phase refrigerant 22 is driven by gravity to gather at the bottom of the chamber 14 , and the gas-phase refrigerant 32 is filled in the chamber 14 . Cavity wall 16 is constructed of, for example, glass material, metallic material, or combinations thereof, and includes a penetrating surface 21 to allow radiant energy and / or light...
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