Method for preparing phase-change copper alloy inner and outer radiating integrated piece for high-power light-emitting diode (LED)

Abstract

The invention relates to a method for preparing a martensite phase transformation copper alloy inner and outer radiating integrated piece for a high-power light-emitting diode (LED). The method comprises the following steps of: 1, determining a martensite phase transformation of a copper alloy; 2, determining a geometric shape of a radiating piece, wherein the end of the radiating piece contacting a chip is named a radiating pad end, and the other end of the radiating piece is positioned outside the package and is named a radiator end; 3, machining the radiating piece for forming; 4, putting the radiating piece into a thermal treatment furnace, heating and performing heat preservation; 5, taking the radiating piece out and performing second-stage heat preservation; 6, taking the radiating piece out and cooling; and 7, performing surface treatment on the radiating piece. The preparation process is simple, the integrated piece is low in manufacturing cost and convenient to use, functions of a radiating pad, a printed board, a radiator and other devices in the prior art can be integrated, and the radiating path and thermal resistance are greatly reduced. Moreover, each gram of alloy can absorb 7 to 9 joules of heat, the radiating capacity is greatly improved, the service life is prolonged, and the luminous efficiency is improved. Therefore, the method is high in development and application value in practical application.

Description

technical field [0001] The invention relates to a preparation method of a heat dissipation part, in particular to a preparation method of a martensitic phase transformation type copper alloy internal and external heat dissipation integrated part for high-power LEDs. Background technique [0002] At present, high-power LED, as the fourth generation electric light source, is called "green lighting source". Since LED is an optoelectronic device, only 15% to 20% of the electrical energy is converted into light during its operation, and the remaining 80% to 85% is converted into heat. If the heat is not discharged to the outside in a timely manner, the temperature of the LED crystal grain interface will be too high, which will seriously affect the luminous efficiency and luminous life. Therefore, in the design and use of high-power LEDs, how to dissipate heat is a big problem. The current heat dissipation solution is to place a large-sized copper heat dissipation pad under the ...

AI Technical Summary

Problems solved by technology

And these connectors do not have the function of phase change heat absorption

In addition, in the entire heat dissipation path, there are many devices and interfaces, the thermal resistance will be large, the heat dissipation will be slow, and the die temperature will be high, so the luminous efficiency and luminous life of the LED will be greatly reduced.