Three-roller multi-wire cutting machine

Abstract

The invention relates to a three-roller multi-wire cutting machine used for cutting a wafer. The three-roller multi-wire cutting machine comprises two cutting rollers and one auxiliary cutting roller, wherein the two cutting rollers are arranged in a cutting chamber in parallel; the auxiliary cutting roller is arranged at or above the symmetric center of the two cutting rollers; each included angle alpha, which is formed between each of the two cutting lines at two sides of the auxiliary cutting roller and a plane in which the axis of the two cutting rollers are located, is 0-30 degrees; two operating platforms and two feeding systems are arranged; the operating platforms and the feeding systems are symmetrically arranged; and the straight guide rails of the two feeding systems are respectively vertical to the cutting lines at the two sides of the auxiliary cutting roller. The three-roller multi-wire cutting machine can be used for cutting two polycrystalline silicon rods at the same time. Besides, the cutting quality is stable, the machine volume is small, the cost is low, the efficiency is high, and the cutting production cost is lowered.

Description

technical field [0001] The invention relates to a multi-wire cutting machine for cutting wafers, in particular to a three-roller multi-wire cutting machine. Background technique [0002] At present, solar-grade silicon wafers and sapphire substrates for LEDs are produced on a large scale using multi-wire cutting machines. figure 1 Shown is the cutting principle diagram of the current NTC MWM442DM model in Japan. Multiple cutting lines 3 are wound on two parallel cutting rollers 11 and 12, and the workpieces 21 and 22 are driven downward by the workbench to meet the cutting rollers 11 and 12 The adjustment movement between the 3 contacts of the cutting line is cut into pieces. This structure can cut two monocrystalline silicon rods at the same time. When cutting two polycrystalline silicon rods, since the hardness of polycrystalline silicon is slightly harder than that of monocrystalline silicon and is not uniform enough, the span L between the two cutting rollers is too lar...

AI Technical Summary

Problems solved by technology

[0005] Since the auxiliary cutting roller is arranged in the middle of the two cutting rollers, the cutting area between the two cutting rollers is divided into two sections, and each cutting section can cut a polysilicon rod independently, so the cutting span of each cutting section can be Reduced to the minimum, it can effectively solve the phenomenon of unstable tension, bending and shaking of the cutting line caused by the large span of the cutting line during the cutting process

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