Ultraviolet laser drilling device

A technology of ultraviolet laser and laser, which is applied in the direction of laser welding equipment, welding equipment, metal processing equipment, etc., can solve the problems that are difficult to realize, achieve high efficiency, good edge processing effect, and reduce the effect of heat-affected zone

Inactive Publication Date: 2011-10-19
SUZHOU DELPHI LASER +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The traditional micro-hole processing method mainly uses small mechanical drills and exposure methods, but it is difficult to improve the drilling efficiency and process holes smaller than 50um.

Method used

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Embodiment Construction

[0016] Such as figure 1 As shown, the UV laser drilling device, the UV Q-switched solid-state laser 1 is an UV Q-switched solid-state laser with an output wavelength of 355nm, and the pulse width is on the order of nanoseconds; the output end of the UV Q-switched solid-state laser 1 is provided with a beam expander 2 , the output end of the beam expander 2 is arranged with a first reflector 3, the first reflector 3 connects with the second reflector 4, the output end of the second reflector 4 is arranged with a beam shaper 5, and the output end of the beam shaper 5 A scanning galvanometer 6 is arranged, the output end of the scanning galvanometer 6 is connected to a focusing mirror 7, and a three-dimensional mobile platform 8 is arranged below the focusing mirror 7, and a suction device and a high-resolution auxiliary positioning imaging system are installed on the three-dimensional mobile platform 8 , The suction device is used to suck away the dust generated in the process, ...

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Abstract

The invention relates to an ultraviolet laser drilling device. The output end of an ultraviolet Q-switched solid laser is provided with a beam expander; the output end of the beam expander is sequentially provided with a first reflecting mirror and a second reflecting mirror; the output end of the second reflecting mirror is provided with a beam shaping device; the output end of the beam shaping device is provided with a scanning galvanometer; the output end of the scanning galvanometer is connected with a focus lens; a three-dimension moving platform is arranged below the focus lens; light beams emitted from the ultraviolet Q-switched solid laser enter the beam expander; the beam expander outputs collimated light beams; the collimated light beams enter the beam shaping device through the first reflecting mirror and the second reflecting mirror; the shaped light beams enter the focus lens through the scanning galvanometer; focusing light spots, of which the energy is in a flat top distribution, are obtained at a focus position; the focus of the focused light beams is positioned on a processing workpiece of the three-dimensional moving platform. During the action of ultraviolet laser and materials, molecules are stripped off by breaking chemical bonds of the materials, a heat affected area is greatly reduced, and a good effect of processing edges is achieved.

Description

technical field [0001] The invention relates to an ultraviolet laser drilling device, which is used for laser drilling of semiconductor wafers, PCB boards, ceramic substrates and the like. Background technique [0002] With the development of electronic products in the direction of portability and miniaturization, there is an increasing demand for circuit board miniaturization. For example, the circuit boards of modern mobile phones and digital cameras are installed with about 1200 interconnecting lines per square centimeter. hole. For micro-vias, in order to effectively ensure the electrical connection between layers and the fixation of external devices, when designing high-speed, high-density PCBs, designers always hope that the vias should be as small as possible, so that the board can not only There is more wiring space, and the smaller the via hole is, the more suitable it is for high-speed circuits. In this way, the micro via hole not only provides a high-speed conne...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/38B23K26/42B23K26/382
Inventor 赵裕兴汪昊
Owner SUZHOU DELPHI LASER
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