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Fine adjuster for projection photoetching objective

A technology for precise adjustment and projection of light, which is applied in the direction of photolithography exposure device, microlithography exposure equipment, installation, etc., can solve the problems of slow adjustment speed, insufficient adjustment accuracy, singleness, etc., and achieve the effect of fast speed and high precision

Active Publication Date: 2013-12-18
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the projection lithography objective lens has very high requirements on the spatial relative position of the lens, and the existing machining accuracy can no longer meet the high-precision relative position requirement. Therefore, the spatial relative position of each lens is adjusted by the adjustment mechanism
It is a common method to use adjustment screws to adjust the spatial relative position of parts. The adjustment screws in the prior art are all screws with a single pitch. When the pitch is large, the adjustment accuracy is not enough, and when the pitch is small, the adjustment speed is slow.

Method used

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  • Fine adjuster for projection photoetching objective
  • Fine adjuster for projection photoetching objective
  • Fine adjuster for projection photoetching objective

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Embodiment Construction

[0023] The following will combine Figure 1 to Figure 5 The precision adjustment device of the projection lithography objective lens of the present invention is further described in detail.

[0024] see Figure 1 ~ Figure 4 , The precision adjustment device of the projection lithography objective lens of the present invention includes a multi-pitch adjustment screw and a matching wrench.

[0025] Such as figure 1 and figure 2 As shown, the multi-pitch adjusting screw includes a cylinder 11 and a cylinder 12;

[0026] The cylinder 12 is sleeved on the cylinder 11, the cylinder 11 is slightly longer than the cylinder 12, and the two ends of the cylinder 11 protrude from the two ends of the cylinder 12 respectively;

[0027] The outer wall of the cylinder 12 is provided with an external thread 122, and the inner wall of the cylinder 12 is provided with an internal thread (not shown in the figure);

[0028] The outer wall of the cylinder 11 is provided with an external threa...

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Abstract

The precision adjustment device of the projection lithography objective lens of the present invention comprises a multi-pitch adjustment screw, and the multi-pitch adjustment screw includes a cylinder and a cylinder; the cylinder is enclosed on the cylinder, and the cylinder is smaller than the circle tube length; the outer wall of the cylinder is provided with external threads, and the inner wall of the cylinder is provided with internal threads; the outer wall of the cylinder is provided with external threads, and the external threads on the outer wall of the cylinder The internal thread on the inner wall of the cylinder matches, and the cylinder is rotated, and the cylinder rotates and moves in the cylinder; the pitch of the external thread on the external wall of the cylinder is greater than the pitch of the external thread on the external wall of the cylinder. The precision adjustment device of the projection lithography objective lens of the present invention has multiple pitches, can use a large pitch for rough adjustment, and can use a small pitch for fine adjustment, and the adjustment speed is fast and the precision is high.

Description

technical field [0001] The invention relates to a lithography machine adjustment device, in particular to a precision adjustment device for projection lithography objective lens. Background technique [0002] Among the front-end manufacturing equipment of large-scale semiconductor integrated circuits, the lithography machine is the most complex and demanding equipment, integrating opto-mechanical technology, especially the requirements for the precision and stability of the mechanical system have almost reached the limit. In order to meet such requirements, in the design and production process of the lithography machine, it is necessary to pay attention to many aspects, especially the determination of the spatial relative position of each lens. [0003] At present, the projection lithography objective lens has very high requirements on the spatial relative position of the lens, and the existing machining accuracy can no longer meet the high-precision relative position requir...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02B7/02G03F7/20
Inventor 方杨
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD