Machine bench for semiconductor technology
A semiconductor and machine technology, which is applied in the field of semiconductor process machines with warped shapes, can solve problems such as vacuum adsorption errors, machine failures, and effects of warped shapes and structures.
Active Publication Date: 2013-03-20
ADVANCED SEMICON ENG INC
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Problems solved by technology
Moreover, the warpage profile of the package is affected by the structure, that is, the distribution of various components in the package, and it is difficult to predict the warpage profile of the package, resulting in arbitrary warping of the package
Therefore, in the subsequent step of cutting the package, due to the random warpage of the package, it is easy to cause vacuum adsorption errors or machine failures.
Method used
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[0013] refer to figure 1 and figure 2 , which respectively show a schematic cross-sectional view and a top view of a machine used in a semiconductor process according to the present invention. refer to image 3 and Figure 4 , respectively show a schematic cross-sectional view and a top view of a machine for semiconductor process according to the present invention, wherein at least one package 2 is placed on the machine 1 . The machine tool 1 for semiconductor process is used to change the warpage profile of the at least one package 2 . The package 2 includes a substrate strip (Substrate Strip) 21 (for example, a lead frame (Leadframe)), several semiconductor components 22 and several sealants 23, the substrate strip 21 has an upper surface 211 and a lower surface 212, these The semiconductor components 22 are located on the upper surface 211 of the substrate strip 21 , and the encapsulants 23 cover the semiconductor components 22 .
[0014] The machine table 1 includes ...
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The invention relates to a machine bench for a semiconductor technology. The machine bench comprises a bearing body, a plurality of supporting objects, a pressing body, a plurality of elastic plates and a plurality of connecting columns; the bearing body is used for bearing a base plate strip; the supporting objects are positioned on the bearing body, and are respectively arranged at two sides ofa plurality of sealing adhesive bodies corresponding to a packaging piece; the pressing body is positioned above the bearing body; the elastic plates are respectively arranged at the position of the sealing adhesive bodies corresponding to the packaging piece; and the connecting columns are respectively connected with the elastic plates and the pressing body. Thus the machine bench can change thebuckling shape of at least one packaging piece to improve the yield of the subsequent process.
Description
technical field [0001] The present invention relates to a machine for semiconductor process, in particular, to a semiconductor process machine capable of changing the warpage shape of a package. Background technique [0002] In the known technology, a package is heated during the molding process, because the coefficients of thermal expansion (Coefficient of Thermal Expansion, CTE) of various components in the package are different, resulting in different expansion degrees of these components, and The package is warped (Warpage). Moreover, the warpage profile of the package is affected by the structure, that is, the distribution of various components in the package, and it is difficult to predict the warpage profile of the package, resulting in arbitrary warping of the package. Therefore, in the subsequent step of cutting the package, due to the random warpage of the package, it is easy to cause vacuum adsorption errors or machine failures. [0003] Therefore, it is necessa...
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IPC IPC(8): H01L21/50
CPCH01L2224/75H01L2224/95
Inventor 金大根金钟京朴徹贤金仁镐
Owner ADVANCED SEMICON ENG INC