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Electromagnetic shielding adhesive tape

A technology of electromagnetic shielding and electromagnetic shielding layer, applied in the fields of magnetic field/electric field shielding, adhesives, electrical components, etc., can solve the problems of tearing, affecting the electrical conductivity and electromagnetic shielding effect of products, affecting the use of products, etc., to achieve good peeling force, The effect of good electromagnetic shielding efficiency and good performance

Inactive Publication Date: 2011-11-16
3M INNOVATIVE PROPERTIES CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, metal foil tapes have some inherent disadvantages: (1) metal (especially copper) is easily oxidized, which affects the overall electrical conductivity and electromagnetic shielding effect of the product; (2) the presence of metal foil makes the overall softness and adhesion of the tape Deviations in clothing performance, prone to wrinkles during use, and easy to be torn in the length and width directions; (3) The thickness of the metal foil itself is too large, making the corresponding tape thickness too thick, which is difficult to meet the current consumer electronics products "light, (4) The electromagnetic shielding tape generally needs to be die-cut into a specific shape when it is used. Traditional metal foil tapes are prone to edge curling (that is, curling) or burrs during die-cutting, resulting in product Inconvenient to use or even impossible to use; (5) The surface of the metal material is prone to scratches and damages, which greatly affects the use of the product
The disadvantage of this patent is that the bonding force between the metal layer formed by sputtering and the resin film is insufficient, which affects its use effect

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0061] Tape preparation:

[0062] Mix acrylate raw gum, ethyl acetate, tackifying resin, and cross-linking agent evenly, then spread it on silicone oil-coated kraft paper, and dry it to make a pressure-sensitive adhesive tape with a thickness of 1.2mils (30μm) spare. Take part of the above-mentioned adhesive tape, and use the magnetron sputtering coating (sputtering) process to deposit a layer of conductive metal on the surface of the adhesive tape (non-release paper surface) for later use. The order of sputtering is: nickel, silver, nickel, the thickness of each layer They are: 30nm, 80nm, 25nm, and the total thickness of the sputtered metal is 135nm. Take another part of the above-mentioned adhesive tape, attach its non-release paper surface to 1.5mils (38μm) PET film, and peel off the original release paper at the same time. Then, the adhesive surface after peeling off the release paper is bonded to the above metal surface, and finally the required electromagnetic shieldi...

Embodiment 2

[0069] Tape preparation:

[0070] Mix acrylate raw gum, ethyl acetate, tackifying resin, and crosslinking agent evenly, and then spread it on silicone oil-coated kraft paper, and dry it to make a pressure-sensitive adhesive tape with a thickness of 0.5 mils (13 μm) spare. Take part of the above-mentioned adhesive tape, and use the magnetron sputtering coating (sputtering) process to deposit a layer of conductive metal on the surface of the adhesive tape (non-release paper surface) for later use. The order of sputtering is: nickel, copper, nickel, the thickness of each layer They are: 40nm, 100nm, 50nm, and the total thickness of the sputtered metal is 190nm. Take another part of the above-mentioned adhesive tape, attach its non-release paper surface to 0.5mils (13μm) PET film, and peel off the original release paper at the same time. Then, the adhesive surface after peeling off the release paper is bonded to the above metal surface, and finally the required electromagnetic s...

Embodiment 3

[0077] Tape preparation:

[0078] Mix acrylate raw rubber with ethyl acetate, tackifying resin, and crosslinking agent evenly, and then spread it on silicone oil-coated kraft paper, and dry it to make a pressure-sensitive adhesive tape with a thickness of 2.0mils (50μm) spare. Take part of the above-mentioned adhesive tape, and deposit a layer of conductive metal nickel on the surface of the adhesive tape (non-release paper surface) by using a magnetron sputtering coating (sputtering) process, with a thickness of 20nm. Take another part of the above-mentioned adhesive tape, attach its non-release paper surface to 1.0mils (25μm) PET film, and peel off the original release paper at the same time. Then, the adhesive surface after peeling off the release paper is bonded to the above metal surface, and finally the required electromagnetic shielding tape is obtained. The total thickness of the produced tape was 125 μm.

[0079] Performance Testing:

[0080] The adhesion (adhesio...

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Abstract

The invention provides an electromagnetic shielding adhesive tape, which comprises a resin film layer, an electromagnetic shielding layer with a sandwich laminated structure, a first adhesive layer bonded with one surface of the resin film layer, a second adhesive layer and a conductive metal layer positioned between the first adhesive layer and the second adhesive layer, wherein the electromagnetic shielding layer is laminated with the resin film layer.

Description

technical field [0001] The invention relates to a novel electromagnetic shielding adhesive tape, which is mainly used for electromagnetic shielding and insulation protection of key parts in electronic products, especially consumer electronic products. Background technique [0002] Electromagnetic shielding tape is widely used in electronic products, especially in consumer electronic products for electromagnetic shielding and protection of key parts. At present, the main electromagnetic shielding tape is composed of a metal foil 1 and a (conductive or non-conductive) pressure-sensitive adhesive layer 2 (as shown in Figure 1(a)), and a resin film 3 can also be arranged on the metal foil 1 (as shown in Figure 1 (b) shown). Among them, the metals used as backing materials are mainly copper and aluminum. This type of tape has the characteristics of high product maturity, good shielding effect and convenient use, so it has been widely used in the industry. [0003] However, met...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/02B32B15/08H05K9/00C09J7/28
CPCC09J7/0292H05K9/0084C09J7/0296C09J2201/602B32B27/00C09J7/28C09J7/29C09J2301/314C09J7/38
Inventor 张文杰吴荣
Owner 3M INNOVATIVE PROPERTIES CO
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