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Film removal method, photoelectric conversion device manufacturing method, photoelectric conversion device, and film removal device

A photoelectric conversion device and beam technology, applied in energy conversion devices, photovoltaic power generation, manufacturing tools, etc., can solve problems such as residual film and yield reduction, reduce space, restrain yield reduction, and restrain poor separation. Effect

Inactive Publication Date: 2011-11-16
SHARP KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] If there are scratches or stains on the transparent substrate, or stains on the film formed on the transparent substrate, there may be a problem that the film remains between the areas that should be separated from each other.
Moreover, the same problem may occur due to other reasons such as process changes
As a result, there is a problem that the yield of the process decreases

Method used

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  • Film removal method, photoelectric conversion device manufacturing method, photoelectric conversion device, and film removal device
  • Film removal method, photoelectric conversion device manufacturing method, photoelectric conversion device, and film removal device
  • Film removal method, photoelectric conversion device manufacturing method, photoelectric conversion device, and film removal device

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Embodiment approach 1

[0064] figure 1 It is a plan view schematically showing the structure of the photoelectric conversion device in Embodiment 1 of the present invention. and, figure 2 (A) and (B) are respectively along figure 1 A schematic cross-sectional view along the line IIA-IIA and along the line IIB-IIB. refer to figure 1 as well as figure 2 A thin-film solar cell 1 as a photoelectric conversion device of this embodiment includes a transparent insulating substrate 2 , a transparent electrode layer 3 , a semiconductor photoelectric conversion layer 4 , a back electrode layer 5 , and an electrode 10 .

[0065] The transparent insulating substrate 2 is a light-transmitting substrate. A transparent electrode layer 3 , a semiconductor photoelectric conversion layer 4 , and a back electrode layer 5 are sequentially stacked on a transparent insulating substrate 2 .

[0066] The transparent electrode layer 3 is a conductive film, and is divided into a plurality of regions by the first sepa...

Embodiment approach 2

[0102] In this embodiment, in order to perform steps S3 and S4 ( image 3 ) and the film removal device that can be used and how to use it will be described

[0103] Figure 20 It is a perspective view schematically showing the structure of the film removal apparatus in Embodiment 2 of this invention. and Figure 21 is expressed by Figure 20 The block diagram of the composition of each function realized by the film removal device.

[0104] refer to Figure 20 as well as Figure 21 , The film removal device 60 of the present embodiment has: a backup roll 61 (fixed part 610), a probe 62 (resistance measuring part 620), a CCD camera 63 (image recognition part 630), a laser emitting part 64 (processing part 640), an X-Y Manipulator 65 (movement control unit).

[0105] The fixing part 610 has a function of fixing the transparent insulating substrate 2 .

[0106] The resistance measuring unit 620 has a function of measuring the resistance of a specific portion of the transp...

Embodiment approach 3

[0132] In this embodiment, for the above-mentioned Embodiment 1 image 3 Another way of step S4 will be described.

[0133] figure 1 and figure 2 The shown thin-film solar cell 1 as a photoelectric conversion device of this embodiment includes a transparent insulating substrate 2 , a transparent electrode layer 3 , a semiconductor photoelectric conversion layer 4 , a back electrode layer 5 , and an electrode 10 .

[0134] The transparent insulating substrate 2 is a light-transmitting substrate. A transparent electrode layer 3 , a semiconductor photoelectric conversion layer 4 , and a back electrode layer 5 are sequentially stacked on the transparent insulating substrate 2 .

[0135] The transparent electrode layer 3 is a conductive film, and is divided into a plurality of regions by the first separation groove 6 . The first separation groove 6 is filled with the semiconductor photoelectric conversion layer 4 .

[0136] The back electrode layer 5 is a conductive film. Th...

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Abstract

A film (3) formed on a substrate (2) is irradiated with a first light beam to divide the film (3) into multiple regions. A repair (RP1) is performed by removing the film (3) at defective removal places (DP) where the film (3) remains between the multiple regions. Thus, it is possible to provide a film removal method whereby the film (3) can be divided into multiple regions with a high yield, and a method for manufacturing a photoelectric conversion device (1) and a film removal device (60) which use said removal method.

Description

technical field [0001] The present invention relates to a film removal method, a method of manufacturing a photoelectric conversion device, a photoelectric conversion device, and a film removal device. Background technique [0002] In the manufacture of a photoelectric conversion device or the like, a step of removing a part of the conductive film on the substrate to separate the conductive film into a plurality of regions may be performed. For example, according to Japanese Unexamined Patent Publication No. 2002-261308 (Patent Document 1), a method of manufacturing a photoelectric conversion device has the following steps. [0003] First, a transparent front electrode layer is formed on a transparent substrate. The transparent front electrode layer is divided into a plurality of cells by forming first separation grooves by laser scribing. On this transparent front electrode layer, film formation and laser scribing of the first thin-film photoelectric conversion unit and t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/36B23K26/00B23K26/03H01L21/027H01L31/04
CPCH01L27/1423Y02E10/50B23K26/4075H01L27/1425B23K26/367H01L31/186B23K26/0876B23K26/409H01L31/046H01L31/0463B23K26/364B23K26/40B23K2103/172B23K2103/50Y02P70/50
Inventor 丰川雅博立花伸介
Owner SHARP KK
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