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Spring piece for sensor

A technology of spring leaf and sensor, applied in the field of spring leaf, to achieve the effect of reasonable design, small linear error and easy calibration

Inactive Publication Date: 2011-11-23
CHANGAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to provide a spring piece of the sensor with high sensitivity, easy calibration, small linear error, strong anti-interference ability, good stability and wide application range for the double cantilever large deformation strain measurement sensor

Method used

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  • Spring piece for sensor
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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] exist figure 1 , 2 , 3, 4, the spring sheet of the sensor in this embodiment is formed by bending a rectangular spring sheet with a rectangular through hole a processed in the middle, the thickness of the spring sheet is 0.4mm, and the rectangular spring sheet is bent to form an upper flat plate 1. The W-shaped structure formed by the lower plate 2 and the folded plate connecting the end of the upper plate 1 and the end of the lower plate 2 as a whole, the upper plate 1 and the lower plate 2 are parallel to each other. The folded plate of this embodiment is composed of an upper plane plate 3 and a lower plane plate 4. The angle α between the upper plane plate 3 and the upper plate 1 is 45°, and the lower plane plate 4 and the lower plane plate The angle β between 2 is 45°. Half of the rectangular through hole a is located on the upper plane plate 3 and the other half is located on the lower plane plate 4 . The rectangular through hole a is symmetrical to the intersect...

Embodiment 2

[0021] In the embodiment, the angle α between the upper plane plate 3 and the upper plate 1 is 20°, the angle β between the lower plane plate 4 and the lower plate 2 is 20°, and the rectangular through hole a is on the upper side The positions of the plane plate 3 and the lower plane plate 4 are the same as in the first embodiment. Other components and the coupling relationship of the components are the same as in Embodiment 1.

Embodiment 3

[0023] In the embodiment, the angle α between the upper plane plate 3 and the upper plate 1 is 70°, the angle β between the lower plane plate 4 and the lower plate 2 is 70°, and the rectangular through hole a is on the upper side The positions of the plane plate 3 and the lower plane plate 4 are the same as in the first embodiment. Other components and the coupling relationship of the components are the same as in Embodiment 1.

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Abstract

The invention discloses a spring piece for a sensor. The spring piece is bent into a W shape which is provided with an upper flat plate and a lower flat plate and is integrally formed by connecting the end part of the upper flat plate, the end part of the lower flat plate, and folded plates, and a rectangular through hole alpha is processed on each folded plate. Under the condition of relatively large displacement ratio, the W-shaped spring piece with the structure has high linearity; the spring piece has a reasonable design, high sensitivity, low linearity error, high antijamming capability and stability, wide application range and the like and is easy to calibrate, and can be used on a double-cantilever large-deformation strain measurement sensor.

Description

technical field [0001] The invention belongs to the technical field of sensors for measuring relative displacement, and in particular relates to a spring sheet used on a strain measuring sensor. Background technique [0002] In the field of engineering, it is often necessary to study the large deformation of materials and structures. For example, when studying the mechanical properties of engineering materials, when the material yields, its relative deformation is relatively large. At present, the commonly used measurement method is to use plastic strain gauges directly Pasted on the test piece, due to the influence of many factors such as the pasting technology, the performance of the strain gauge, the performance of the glue used for the patch, the ambient temperature and the ambient humidity, the measurement effect is often very unsatisfactory. In addition, when studying the mechanical properties of masonry structures, it is necessary to measure the deformation of the blo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01B5/30
Inventor 王建华胡大琳任更峰陈凤翔韩学坤赵艳峰张治军
Owner CHANGAN UNIV
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