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LED (light-emitting diode) and packaging method thereof

A LED chip and cavity technology, applied in the field of lighting, can solve the problems of low LED brightness, lack of brightness of LED chip 4, large bonding area, etc., and achieve the effects of improving yield rate, cost saving, and uniform color

Active Publication Date: 2013-07-10
SHENZHEN JUFEI OPTOELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are still the following defects: the packaging structure provides a light-emitting array composed of multiple LED point light sources, rather than a complete surface light source; compared with the surface light source, the brightness of the LED provided by this prior art is relatively low
Although the LED with this structure can form a surface light source, due to the large volume of the cavity 2, the volume of the injected colloid is also large, and the bonding area with the substrate 1 is also large, resulting in low bonding strength between the colloid and the substrate 1. , the colloid is easy to degumming, causing one or several LED chips 4 to lack brightness; In this structure, if the colloid filled in the cavity 2 is fluorescent glue 31, the distribution of phosphor powder in the normal direction of the LED chip 4 is less, and the distribution of phosphor powder between each LED chip 4 is more, resulting in the luminous color of the LED uneven

Method used

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  • LED (light-emitting diode) and packaging method thereof
  • LED (light-emitting diode) and packaging method thereof
  • LED (light-emitting diode) and packaging method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Please refer to figure 2 , LED, that is, light-emitting diodes, includes a substrate 1 and LED chips 4, and a plurality of concave first cavities 21 are arranged at intervals in the substrate 1, and LED chips 4 are placed at the bottom of each first cavity 21. The upper part of a cavity 21 is provided with a concave second cavity 22, the second cavity 22 is connected with the first cavity 21, the first cavity 21 and the second cavity 22 are filled with colloid, and the colloid is filled in the second cavity. The outlet of the body 22 forms the light emitting surface of the LED.

[0026] The substrate 1 can be a metal substrate, a ceramic substrate or a silicon substrate with good heat dissipation performance, and when it is a metal substrate, it can be an aluminum substrate or a copper substrate. Usually, in order to improve the overall heat dissipation performance, the bottom surface of the substrate 1 is also provided with a heat sink covering the entire bottom surf...

Embodiment 2

[0035] For the LED in Example 1, the present invention also provides an LED packaging method, which adds a step of testing the performance of the LED chip after the glue injection into the first cavity is completed, and according to the test results, it is decided to repair the LED chip , or continue to the next step, thereby improving the yield of LED. The method specifically includes steps:

[0036] 1) Die-bonding process: the LED chip is fixed on the bottom of the first cavity by wire bonding and flip-chip;

[0037] 2), the first power-on test: power-on test LED chip luminescence;

[0038] 3) Quantitatively inject colloid into the first cavity, for example, inject fluorescent glue into the first cavity at one time with a fully automatic quantitative dispensing machine. The fluorescent glue can be a mixture of yellow, red, green, orange fluorescent powder or a combination thereof with epoxy or silica gel or silicone resin.

[0039] 4), the second power-on test: power-on t...

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PUM

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Abstract

The invention discloses an LED (light-emitting diode) and a packaging method thereof. The LED comprises a substrate and a plurality of first concave chambers which are arranged on the substrate at intervals; an LED chip is displaced at the bottom of each of the first chambers; a second concave chamber which is communicated with the first chamber is further arranged above the first chamber; glues are filled in the first chambers and the second chambers; and a light exit surface is formed at the concave port of the second chamber. The LED with the structure can provide an area source with high luminous intensity and uniform illuminant color. In the packaging method of the LED, a test and after-sale service step is added to the LED chip after glue injection to the first chambers is finished,so that yield of the LEDs is increased and production cost is saved.

Description

technical field [0001] The invention relates to the lighting field, in particular to a light emitting diode and a packaging method thereof. Background technique [0002] An existing multi-chip LED, such as a Chinese utility model patent with a publication date of August 10, 2005 and a publication number of CN2717026Y, discloses a light-emitting diode with a multi-chip package structure. The structure includes a substrate on which a For the above concave cups, more than one tube core is placed in each concave cup, and the electrodes of each tube core are connected with gold wires, and transparent colloid is injected into the concave cups. [0003] The light-emitting diode with this structure has the advantages of compact structure, high integration degree and the like. However, there are still the following defects: the packaging structure provides a light-emitting array composed of multiple LED point light sources instead of a complete surface light source; compared with th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L25/13H01L33/48H01L33/64H01L33/54
CPCH01L2224/48091H01L2224/49107H01L2924/16195H01L2924/181
Inventor 孙平如
Owner SHENZHEN JUFEI OPTOELECTRONICS CO LTD