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A spraying mechanism and spraying method

A technology of spraying mechanism and atomizing nozzle, applied in coating, spraying device, liquid spraying device, etc., can solve the problems of colloid flow and accumulation, achieve the effect of good spraying shape and ensure yield

Inactive Publication Date: 2011-11-30
SHENYANG KINGSEMI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if you encounter a colloid that is easier to flow and cannot be cured in time, it is easy to cause the colloid to flow and accumulate at the bottom

Method used

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  • A spraying mechanism and spraying method

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Experimental program
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Embodiment Construction

[0019] The present invention will be further described below in conjunction with the accompanying drawings.

[0020] like Figure 1-2 As shown, the spraying mechanism of the present invention mainly includes: a wafer 1 with a shape, a hot plate 2 capable of vacuum adsorption and heating, a motor 3 capable of precise rotation, an ultrasonic atomizing nozzle 4, and an electric motor capable of XY biaxial linkage. Cylinder 5, thimble for loading wafer 6, device for adjusting nozzle height 7, rotation position detection sensor 8 of adsorption hot plate, etc., the specific structure is as follows:

[0021] A device 7 for adjusting the height of the nozzle is installed on the electric cylinder 5 capable of XY dual-axis linkage, and an ultrasonic atomizing nozzle 4 is installed on the top of the device 7 for adjusting the height of the nozzle. , the wafer 1 with the shape is adsorbed on the thimble 6 on which the wafer is loaded, and the hot plate 2 with heating function can be vacu...

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Abstract

The invention relates to the field of semiconductor manufacturing, in particular to a spraying mechanism and a spraying method of an insulating layer in a micromechanical electronic system and a three-dimensional through-silicon hole formed by spraying glue. The spraying mechanism can be equipped with a device for adjusting the height of the nozzle on the XY double-axis linkage electric cylinder, and the top of the device for adjusting the height of the nozzle is provided with an ultrasonic atomizing nozzle, which can be vacuum-adsorbed. The wafer with shape is adsorbed on the thimble of the wafer, and the hot plate with heating function can be vacuum adsorbed and connected to the motor. The motor is equipped with a rotation position detection sensor for the adsorption hot plate, an ultrasonic atomization nozzle and corresponding to the wafer. After the wafer is loaded on the hot plate, the hot plate and the heated wafer are turned upside down as a whole, and the atomization nozzle is placed on the lower part of the wafer, and the direction of the nozzle faces the wafer upwards. Scanning and spraying on the whole wafer in this way realizes that the atomized colloid is evenly sprayed and covered on the wafer with topography.

Description

Technical field: [0001] The invention relates to the field of semiconductor manufacturing, in particular to a spraying mechanism and a spraying method of an insulating layer in a micromechanical electronic system (mems) and a three-dimensional through-silicon via (tsv) made by spraying glue. Background technique: [0002] At present, the known glue spraying method is to place a patterned wafer on a heating chuck, and spray the atomized glue or insulating glue evenly on the surface of the wafer through an ultrasonic atomizing nozzle. However, if you encounter colloids that are more likely to flow and cannot be cured in time, it is easy to cause the colloid to flow and accumulate at the bottom. Invention content: [0003] In order to overcome the above disadvantages, the object of the present invention is to provide a spraying mechanism and glue spraying method to prevent the colloid from flowing and accumulating due to gravity. [0004] Technical scheme of the present inve...

Claims

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Application Information

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IPC IPC(8): B05B17/06B05C5/00B05C13/02B05D1/02
Inventor 王绍勇
Owner SHENYANG KINGSEMI CO LTD