A kind of silicon cutting method

Abstract

A method for cutting silicon material. When the silicon block is in contact with the wire saw, the cutting starts. First, the wire saw cuts forward for a certain distance, and then the guide wheel drives the wire saw to change direction, and the wire saw cuts backward in the opposite direction; After the wire saw cuts a certain distance backward, the guide wheel drives the wire saw to change direction again, and the wire saw continues to cut forward; the invention wears less steel wire for each cutting, so that the steel wire can be cut multiple times, greatly reducing the The usage of steel wire reduces the production cost.

Description

technical field [0001] The invention relates to a silicon crystal processing method, in particular to a silicon material cutting method. Background technique [0002] In recent years, the production of solar cells, as an emerging industry of environmentally friendly new energy, has been widely welcomed by all walks of life, and the solar photovoltaic industry has developed rapidly. [0003] As a solar cell with relatively mature technology and relatively stable quality, silicon cells are widely used. As the core link of silicon cell production, the crystal cutting technology has a considerable impact on the quality and cost of silicon cells. big impact. At present, the relatively mature crystal cutting technology uses extremely thin steel wires to move at high speed to drive the mortar to rub against the silicon block to achieve the purpose of cutting. However, in this process, as a consumable, the steel wire wears out very quickly and can only be used once, which is very ...

AI Technical Summary

Problems solved by technology

However, in this process, as a consumable, the steel wire is consumed very quickly and can only be used once, which is very expensive

[0004] There are also some crystal cutting processes on the market, which use the steel wire twice, but taking the φ0.12mm steel wire used to cut 8" polycrystalline silicon wafers twice in the polycrystalline cutting machine currently on the market as an example, the steel wire is used in the first cutting. There has been a lot of wear and tear, and the occurrence rate of a series of problems such as high line break rate, many silicon wafer line marks, and large TTV in the second cutting has been greatly increased, resulting in low yield and poor cutting effect in the second cutting