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Thermosetting modified cyanate ester resin and preparation method thereof

A cyanate ester resin and thermosetting technology, which is applied in the field of thermosetting modified cyanate ester resin and its preparation, can solve the problems of reduced bending strength and modulus, and small improvement in mechanical properties, and achieve good heat resistance and mechanical properties. Effect

Inactive Publication Date: 2012-12-05
TONGJI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, cyanate / epoxy modified resin has the disadvantage of small improvement in mechanical properties, such as the ratio of the two monomers (-OCN : epoxy) Although the impact strength of the cured resin has increased, the flexural strength and modulus show a downward trend

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Weigh 40g of phenolic cyanate (PT, average molecular weight 900), 5g of 2,2'-(1,3-phenylene)-bisoxazoline, 10g of E-44 epoxy resin, at 80~100℃ Melt evenly, add 0.01g N,N-dimethylpiperazine, stir evenly, put it in a vacuum oven at 80°C for degassing for 15 minutes, then pour it into a mold coated with a silicone ester release agent, and place it in an electronic oven Curing is carried out according to the curing process of 180°C / 1h + 200°C / 2h + 240°C / 3h. A brownish-red cured resin was obtained with a glass transition temperature of 277° C. (DMA method) and a bending strength of 118.4 MPa.

Embodiment 2

[0026] Weigh 40g bisphenol A cyanate, 5g 2,2'-(1,3-phenylene)-bisoxazoline, 10g E-44 epoxy resin, melt evenly at 80~100℃, add 1.2 g organotin catalyst and 0.01g N,N-dimethylpiperazine, the curing process of the resin is the same as in Example 1. A brownish-red cured resin was obtained with a glass transition temperature of 241° C. (DMA method) and a bending strength of 147.1 MPa.

Embodiment 3

[0028] Weigh 20g bisphenol A cyanate, 10g 2,2'-(1,3-phenylene)-bisoxazoline, 20g E-51 epoxy resin, melt evenly at 80~100℃, add 0.6 g organotin catalyst and 0.1g triethylenediamine, the curing process of the resin is the same as in Example 1. A brown-red cured resin was obtained with a glass transition temperature of 226° C. (DMA method) and a bending strength of 156.4 MPa.

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PUM

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Abstract

The invention relates to thermosetting modified cyanate ester resin and a preparation method thereof. The thermosetting modified cyanate ester resin is prepared from cyanate ester, a bis-oxazoline compound and epoxide resin through a co-curing reaction under the action of catalysts. The resin comprises the following raw materials in percentage by mass: 10 to 85 percent of cyanate ester, 5 to 40 percent of bis-oxazoline compound and 10 to 70 percent of epoxide resin. The catalysts are an organo-tin compound and tertiary amine. The using amount of the organo-tin compound is 2 to 4 percent of the total mass of the resin and the using amount of the tertiary amine is 0.01 to 1 percent of the total mass of the resin. For the modified resin disclosed by the invention, the organo-tin compound andthe tertiary amine are used as the catalysts to carry out catalytic curing. The cured resin has excellent heat resistance and mechanical property.

Description

technical field [0001] The invention relates to a thermosetting modified cyanate resin and a preparation method thereof. Background technique [0002] Epoxy resin is a kind of high-performance resin matrix material widely used in aerospace and civil fields. It has good mechanical properties, good adhesion to reinforcing fibers when making composite materials, and good process performance. The amount of epoxy resin is large, but the heat resistance of epoxy resin is not high enough (Tg<150°C for ordinary epoxy, Tg<200°C for special structure epoxy), this shortcoming limits the use of epoxy resin in some high-tech field application and development. For example, in the field of aerospace, epoxy resin has the problems of low heat resistance and high water absorption; in the field of printed circuit boards, epoxy resin has problems of low heat resistance and poor flame retardancy, etc. [0003] The copolymerized modified resin system composed of cyanate ester and epoxy h...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G73/06C08G59/40
Inventor 李文峰
Owner TONGJI UNIV
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