Electronic silver paste and preparation process thereof
A preparation process and electronic technology, applied in cable/conductor manufacturing, circuits, electrical components, etc., can solve the problems of unfavorable electrical properties and mechanical properties of silicon substrates of crystalline silicon solar cells, increase light conversion efficiency, and improve peeling mechanical strength. , increasing the effect of contact points and tunneling
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Embodiment 1
[0030] An electronic silver paste and its preparation process. The electronic silver paste is prepared by combining silver powder, glass powder synthesized through technological processing, an organic carrier and additives. A dispersant is added during the combination preparation process; the weight percentage of the above components is as follows :
[0031] Silver powder 65%, glass powder 9%, organic vehicle 24%, additive 1%, dispersant 1%;
[0032] The particles of the silver powder are below 2 μm, and the shape is not limited;
[0033] Described glass powder is boron-bismuth-silicon-aluminum-tin-niobium-titanosilicate system, by B 2 o 3 、 Bi 2 o 3 , SiO 2 、Al 2 o 3 , SnO 2 , Nb 2 o 5 、TiO 2 The raw materials are processed and synthesized, and the weight percentages of each component are as follows:
[0034] B 2 o 3 2%, Bi 2 o 3 30%, SiO 2 19%, Al 2 o 3 2%, SnO 2 25%, Nb 2 o 5 14%, TiO 2 8%;
[0035] The organic carrier is a viscous liquid formed...
Embodiment 2
[0048] An electronic silver paste and its preparation process. The electronic silver paste is prepared by combining silver powder, glass powder synthesized through technological processing, an organic carrier and additives. A dispersant is added during the combination preparation process; the weight percentage of the above components is as follows :
[0049] Silver powder 63%, glass powder 6%, organic vehicle 28%, additive 2%, dispersant 1%;
[0050] The particles of the silver powder are below 2 μm, and the shape is not limited;
[0051] Described glass powder is boron-bismuth-silicon-aluminum-tin-niobium-titanosilicate system, by B 2 o 3 、 Bi 2 o 3 , SiO 2 、Al 2 o 3 , SnO 2 , Nb 2 o 5 、TiO 2 The raw materials are processed and synthesized, and the weight percentages of each component are as follows:
[0052] B 2 o 3 14%, Bi 2 o 3 25%, SiO 2 20%, Al 2 o 3 7%, SnO 2 20%, Nb 2 o 5 7%, TiO 2 7%;
[0053] The organic carrier is a viscous liquid form...
Embodiment 3
[0066] An electronic silver paste and its preparation process. The electronic silver paste is prepared by combining silver powder, glass powder synthesized through technological processing, an organic carrier and additives. A dispersant is added during the combination preparation process; the weight percentage of the above components is as follows :
[0067] Silver powder 80%, glass powder 5%, organic vehicle 12%, additive 1%, dispersant 2%;
[0068] The particles of the silver powder are below 2 μm, and the shape is not limited;
[0069] Described glass powder is boron-bismuth-silicon-aluminum-tin-niobium-titanosilicate system, by B 2 o 3 、 Bi 2 o 3 , SiO 2 、Al 2 o 3 , SnO 2 , Nb 2 o 5 、TiO 2The raw materials are processed and synthesized, and the weight percentages of each component are as follows:
[0070] B 2 o 3 22%, Bi 2 o 3 26%, SiO 2 10%, Al 2 o 3 12%, SnO 2 18%, Nb 2 o 5 10%, TiO 2 2%;
[0071] The organic vehicle is a viscous liquid for...
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