System and method for automatically controlling multi-wire cutting machine

Abstract

The invention discloses a system for automatically controlling a multi-wire cutting machine and is applicable to the field of machine tool processing. The system comprises a working table server, a main cutting server, a pay-off server, a take-up server, a tension sensor and a programmable logic controller (PLC), wherein the working table server is used for driving a cut material to perform positioning motion according to preset process parameters; the main cutting server, the pay-off server and the take-up server are respectively used for controlling cutting motion, pay-off motion and take-up motion; the tension sensor is used for acquiring pay-off tension and take-up tension; and the PLC is used for performing proportion integration differentiation (PID) operation according to the pay-off tension and the take-up tension and adjusting the speed ratio of the pay-off server to the main cutting server and the speed ratio of the take-up server to the main cutting server. The invention also provides a method for automatically controlling the multi-wire cutting machine. By adoption of the method, the synchronous proportional linkage of cutting, pay-off and take-up can be realized, so the stability of the tension during multi-wire cutting is relatively higher, the consistency of processed workpieces is better, the degree of automation of the system is higher, and the system is more convenient to use.

Description

technical field [0001] The invention relates to the field of machine tool processing, in particular to an automatic control system and method for a multi-wire cutting machine. Background technique [0002] Multi-wire cutting refers to a new type of cutting process that brings abrasives into the workpiece processing area for grinding through high-speed reciprocating motion of metal wires, and cuts hard and brittle materials such as semiconductor silicon wafers into hundreds of thin slices at a time. It is different from traditional cutting methods such as saw blades and grinding wheels, as well as advanced laser cutting and inner circle cutting. Its principle is that a high-speed moving steel wire drives the cutting blade attached to the steel wire to The rod is rubbed to achieve the cutting effect. [0003] Silicon wafers are the main production materials in the fields of semiconductors and photovoltaics. The multi-wire cutting technology for silicon wafers is currently the...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a multi-wire cutting machine automatic control system and method to solve the problems of stable control of tension and consistency of processed workpieces when multi-wire cutting equipment is running at high speed

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