Atmospheric plasma device and manufacturing method thereof

Abstract

The invention discloses an atmospheric plasma device and a manufacturing method thereof. The atmosphere plasma device comprises an anode, a cathode and an insulating medium arranged between the anode and the cathode, wherein ionizable gas is filled between the anode and the cathode; the cathode comprises a plurality of plasma generation and elimination units, each plasma generation and elimination unit comprises uniformly distributed and same plasma elimination areas and plasma generation areas; and the plasma elimination areas and the plasma generation areas are uniformly arranged, and the spacing of centers of every two plasma elimination areas among three mutually adjacent plasma elimination areas is equal. According to the mode, corrosion of plasma to the cathode and the insulating medium can be reduced, the service life of the atmosphere plasma device is prolonged, and the surface cleaning uniformity of the substrate can be improved.

Description

technical field [0001] The invention relates to the field of plasma display panel manufacturing, in particular to an atmospheric pressure plasma device and a manufacturing method thereof. Background technique [0002] As matter is continuously given energy, it heats up and changes from solid to liquid and then to gas. Continued application of energy results in a further change of state in which neutral atoms or molecules of the gas undergo high-energy collisions to produce negatively charged electrons, positive or negative ions, and other species. This mixture of charged species exhibits a collective behavior known as a "plasma". [0003] Atmospheric pressure plasma treatment as a new surface treatment technology, such as plasma cleaning, has low temperature and normal pressure treatment, will not cause damage to the material surface, no arc, no vacuum chamber, no harmful gas suction system, long-term use and It has many advantages such as no physical damage to the operato...

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Problems solved by technology

[0007] (1) The circular design method is adopted, which does not take into account the equal design of the plasma generation area and the plasma exclusion area, which will easily cause the plasma to easily stay between the anode and the cathode, corrode the cathode and the insulating medium, and reduce the life of the device;

[0008] (2) Adopting the Chidori arrangement, the position of the plasma exclusion area and the position of the plasma generation area are not equidistant, and the plasma close to the plasma exclusion area is easy to be excluded, but the plasma far away from the plasma exclusion area is not easy to be excluded, so that the plasma in the local area is easy stagnation, while the plasma concentration near the plasma exclusion area on the outside of the cathode is higher, and the plasma concentration farther away from the plasma exclusion area is lower, resulting in uneven distribution of plasma and poor surface treatment uniformity

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