Polycrystalline diamond compact including a cemented tungsten carbide substrate that is substantially free of tungsten carbide grains exhibiting abnormal grain growth and applications therefor

A technology for polycrystalline diamond, grain growth, used in transportation and packaging, metal processing equipment, manufacturing tools, etc.

Inactive Publication Date: 2012-01-25
US SYNTHETIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Such tungsten carbide grains exhibiting abnormal grain growth may protrude from the sintered tungsten carbide substrate into the PCD table, thereby introducing stress concentrations and / or may cause the PCD table to dislodge from the sintered Disadvantages of Tungsten Carbide Substrate Stripping

Method used

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  • Polycrystalline diamond compact including a cemented tungsten carbide substrate that is substantially free of tungsten carbide grains exhibiting abnormal grain growth and applications therefor
  • Polycrystalline diamond compact including a cemented tungsten carbide substrate that is substantially free of tungsten carbide grains exhibiting abnormal grain growth and applications therefor
  • Polycrystalline diamond compact including a cemented tungsten carbide substrate that is substantially free of tungsten carbide grains exhibiting abnormal grain growth and applications therefor

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Embodiment Construction

[0019] Embodiments of the invention relate to PDCs comprising PCD tables that are substantially free of defects formed from tungsten carbide grains exhibiting AGG by bonding PCD tables to sintered This PDC is fabricated by either forming a PCD table integrally with a sintered carbide substrate comprising one or more carbon-deficient tungsten-containing η Mutually. The disclosed PDCs can be used in a variety of applications such as rotary drill bits, processing equipment, and other items and devices.

[0020] figure 2 is a cross-sectional view of an embodiment of a PDC 200 comprising a PCD table 202 integrally formed with a sintered tungsten carbide substrate 208 substantially free of tungsten carbide grains exhibiting AGG. The PCD table 202 contains a plurality of directly bonded diamond grains exhibiting diamond-to-diamond bonding therebetween, defining a plurality of interstitial regions. The microstructural and mechanical properties of the PCD table 202 are properties d...

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Abstract

Embodiments relate to polycrystalline diamond compacts ("PDCs") including a polycrystalline diamond ("PCD") table that is substantially free of defects formed due to abnormal grain growth of tungsten carbide grains, and methods of fabricating such PDCs. In an embodiment, a PDC comprises a cemented tungsten carbide substrate including an interfacial surface that is substantially free of tungsten carbide grains exhibiting abnormal grain growth, and a PCD table bonded to the interfacial surface of the cemented tungsten carbide substrate. The PCD table includes a plurality of bonded diamond grains defining a plurality of interstitial regions. At least a portion of the interstitial regions includes a metal-solvent catalyst disposed therein. The PCD table may be substantially free of chromium or the PCD table and the cemented tungsten carbide substrate may each include chromium.

Description

technical field [0001] Water-resistant polycrystalline diamond compacts (polycrystalline diamond compacts, polycrystalline diamond compacts, "PDC") are used in a variety of mechanical applications. For example, PDCs are used in drilling tools (eg, cutting elements, gage trimmers, etc.), machining equipment, bearing arrangements, wire drawing machines, and in other mechanical equipment. Background technique [0002] PDCs have been found to be particularly useful as superabrasive cutting elements in rotary drill bits such as roller cone bits and fixed cutting edge drill bits. PDC cutting elements typically include a superabrasive diamond layer commonly referred to as a diamond table. The diamond table is formed and bonded to a cemented carbide substrate (cemented carbide substrate) using a high pressure / high temperature ("HPHT") process. The PDC cutting elements may be brazed directly into prefabricated pockets, pockets, or other receptacles formed within the bit body. The ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F7/06E21B10/573
CPCC22C26/00B22F2005/001B22F2998/00C22C2204/00E21B10/5735C04B35/528C04B2235/3847C04B2237/36C04B2237/363C04B2237/555Y10T428/24893Y10T428/30B24D3/10C23F1/28C23F1/02C22C29/08
Inventor 德布库玛·穆克霍帕迪艾肯尼思·E·贝尔塔格诺里穆罕默德·N·萨尼
Owner US SYNTHETIC CORP
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