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Method of working thin layer on work and thin layor working apparatus

A processing method and a processing device technology, which are applied in the field of thin film processing of workpieces and thin film processing devices, can solve problems such as inability to realize insulation resistance and insufficient removal of decomposed substances, so as to improve output utilization efficiency, ensure insulation resistance, and improve quality Effect

Inactive Publication Date: 2012-02-01
HITACHI SEIKO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The reason why it has not been put into practical use is that the decomposition products produced by processing cannot be sufficiently removed, and the decomposition products attached to the inside of the groove will reduce the insulation resistance to 50MΩ, and the ideal insulation resistance of 2000MΩ cannot be realized.

Method used

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  • Method of working thin layer on work and thin layor working apparatus
  • Method of working thin layer on work and thin layor working apparatus
  • Method of working thin layer on work and thin layor working apparatus

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Embodiment Construction

[0078] When processing a workpiece with a thin film on the surface of the transparent glass, the present invention uses compressed air to support the workpiece in the vertical direction in consideration of processing accuracy and machinability, while tracking the vertical direction of the workpiece with a clamping device In a state where the workpiece is moved and clamped, laser light is irradiated from the back side of the workpiece to process the film on the front side. Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0079] 1. Overall structure

[0080] figure 1 It is a functional block diagram showing the structure of a thin film processing apparatus according to an embodiment of the present invention. In this figure, the thin film processing device of this embodiment has a thin film processing device main body SA, a main controller SB, and a sub-controller SC. The thin film processing device main body SA consists of a lase...

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Abstract

To improve quality of work, a laser beam working point is maintained at a constant level. An apparatus for working a work (101) having a thin layer disposed on a transparent glass comprises a work support (4) that vertically support a bottom surface of the work (101) by means of pressurized air, a clamping means (6) capable of vertically moving to follow vertical deflection of the work (101) and a working head (A4) capable of working the thin layer by means of a laser. The working head (A4) directs a laser beam from the bottom surface of the work (101) to work the thin layer disposed on the upper surface of the work (101). The head is further provided with nozzles capable of emitting cooling medium from the side where the laser beam emitted from the working head (A4) reaches the thin layer (upper surface), thereby enabling working the thin layer while applying cooling medium.

Description

Technical field [0001] The present invention relates to a thin film processing method and a thin film processing device for a workpiece for processing a thin film on a workpiece having a thin film disposed on the surface of a transparent glass. Background technique [0002] As a product in which a thin film is arranged on the surface of transparent glass, for example, a solar cell is known. Figure 29 It is a plan view of the solar cell manufacturing process. In this figure, the solar cell as the workpiece 101 is formed by forming multiple thin film layers on transparent glass 102. When the multiple thin film layers formed on the glass 102 are formed on the entire surface, the surrounding thin film layers will be Is removed. This removed part is called the removal part 107. [0003] Figure 30 It is a cross-sectional view illustrating the manufacturing process of the solar cell. Figure (a) shows the first step, Figure (b) shows the second step, Figure (c) shows the third step, and...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/36B23K26/10B23K26/12B23K26/14B23K26/16B23K26/42H01L31/04B23K101/40B65G49/06H01L21/677
CPCB65G2249/045B23K26/367B65G49/064B23K26/0057B23K26/0853B23K26/0048B23K26/1417B23K37/0408H01L21/6838B23K26/409H01L31/18B23K26/0006B23K26/364B23K26/146B23K26/40B23K26/53B23K2103/16B23K2103/172Y02E10/50B23K26/361B23K26/10B23K26/14H01L31/04
Inventor 荒井邦夫金谷保彦石井和久本田宽
Owner HITACHI SEIKO LTD