Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

High-power light emitting diode with radiating substrate made of diamond-like film-copper composite material

A diamond-like film and light-emitting diode technology, applied in the field of LED invention, can solve problems such as heat dissipation of LED chips, and achieve the effects of increasing the contact area, solving the decrease in brightness, and solving the shortening of lifespan

Inactive Publication Date: 2013-11-06
SOUTH CHINA NORMAL UNIVERSITY
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is to overcome the heat dissipation problem of the existing LED chips, and provide a high-power light-emitting diode whose heat dissipation substrate is a diamond-like film-copper composite material

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • High-power light emitting diode with radiating substrate made of diamond-like film-copper composite material
  • High-power light emitting diode with radiating substrate made of diamond-like film-copper composite material
  • High-power light emitting diode with radiating substrate made of diamond-like film-copper composite material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0031] refer to figure 1 As shown in FIG. 7 , the present invention provides a preferred embodiment of a high-power LED packaging structure using a diamond-like film-copper composite material as a heat dissipation substrate, but the embodiment of the present invention is not limited thereto.

[0032] Such as figure 1 As shown: the upper surface of the heat dissipation substrate 14 is copper 2 , the lower surface is copper 2 and the diamond-like film 1 , the diamond-like film 1 is below the copper plate 2 , and the upper and lower surfaces are flat. The LED chip 6 is directly placed on the heat dissipation substrate 14 through the die-bonding glue 5 . The top of the LED chip 6 is a lens 8, and the shape of the lens 8 can be changed according to the requirements of different light emitting angles. The lens 8 can be made of elastic plastic, glass, resin, acrylic and other materials. There is an adhesive layer 3 and a circuit layer 4 on the heat dissipation substrate 14; ther...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a high-power light emitting diode with a radiating substrate made of a diamond-like film-copper composite material. The diode comprises an LED (Light Emitting Diode) chip, a lens, a reflection cup and the radiating substrate made of the diamond-like film-copper composite material, wherein the LED chip is positioned in the reflection cup; the lens is positioned above the reflection cup; the lower surface of the cooling substrate directly contacts with air; and the LED chip is directly placed on the upper surface of the cooling substrate by die attaching resin or metal eutectic welding. The composite material disclosed by the invention extracts heat from high-power LED via a shortest path, and directly emits heat to the air so as to effectively lower the junction temperature of the LED. Because the composite material can lower the thermal resistance of the whole LED packaging structure, the composite material can be used for cooling single high-power LED and an LED module by combining with an optimized structural design, thereby realizing high-luminance shining for a long term.

Description

technical field [0001] The present invention relates to the technical field of LED inventions. The present invention relates to the technical field of LED inventions. In particular, it relates to a high-power LED that directly uses a diamond-like film-copper composite material as a heat dissipation substrate. Background technique [0002] LED light source has many advantages such as low driving voltage, long life, high luminous flux, anti-vibration, not afraid of repeated switching of power supply, small structure, safety, high efficiency, energy saving, etc., and has become the best light source choice to replace the traditional invention light source. With the rapid development of LED technology, the preparation technology of high-power LED has become increasingly mature. However, the current LED inventions generally concentrate a large number of ordinary small LED tubes or multiple power tubes in one lamp, and most of them adopt closed lamp structure. Design, a typical ex...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48H01L33/64
CPCH01L2924/181H01L2224/48091H01L2224/48137H01L2224/73265H01L2924/00014H01L2924/00012
Inventor 姚光锐范广涵郑树文张涛刘小平苏晨宋晶晶
Owner SOUTH CHINA NORMAL UNIVERSITY
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com