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Airtight sintering device of glass tube and MEMS chip

A technology of sintering device and glass tube, which is applied in the directions of micro-structure device, manufacturing micro-structure device, decorative arts, etc., can solve the problem that the vacuum degree of vacuum micro-cavity cannot be effectively controlled, etc.

Active Publication Date: 2012-02-22
NO 24 RES INST OF CETC
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In order to overcome the problem that the vacuum degree of the vacuum microcavity cannot be effectively controlled in the conventional high-precision resonant pressure sensor packaging process, the invention provides an airtight sintering device for glass tubes and MEMS chips, which improves the vacuum degree of the vacuum microcavity and realizes vacuum Effective control of the vacuum degree of the microcavity, while improving the pass rate of high-precision resonant pressure sensor products

Method used

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  • Airtight sintering device of glass tube and MEMS chip
  • Airtight sintering device of glass tube and MEMS chip
  • Airtight sintering device of glass tube and MEMS chip

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Embodiment Construction

[0021] The present invention will be described in further detail below in conjunction with specific embodiments and accompanying drawings.

[0022] The invention is an airtight sintering device for glass tubes and chips, including: 1) a main machine base and a heating furnace body, 2) a lifting pressure adjustment structure, 3) a glass tube and a vacuum connection machine structure, and other main parts. Its overall structure diagram is as figure 1 shown.

[0023] figure 1 It is a schematic view of the overall structure of the glass tube and MEMS chip airtight sintering device of the present invention. figure 1 Among them, the total thickness of the main body base (1) is 20-40mm, to ensure that the main body base (1) has sufficient strength, the heating furnace body (2) and the wiring seat (10) are connected to the main body base (1) with screws On the column (14) of the main body support (1), a lifting regulator (22) and a shut-off valve (24) are connected with a fixed han...

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Abstract

The invention discloses an airtight sintering device of glass tubes and MEMS chips, which comprises a main frame, a heating furnace body, a lifting adjusting member, and a lifting pressure adjusting handle, a stop valve, an air exhaust connecting member, and the like. In the device of the invention, two MEMS chips are sintered together with a glass tube; the glass tube is connected to a vacuum-pumping device for vacuum pumping; the glass tube is sintered together with two MEMS chips through glass powder so as to form a vacuum microcavity; the invention solves the problem in traditional devices that organic gas which is generated during glass slurry sintering and is released into the vacuum microcavity can not be removed; the vacuum degree is up to 5*10-5 Pa, and the qualified rate of high-precision resonance-type pressure sensors is increased. The invention is applicable to fields of packaging technology of resonance-type pressure sensors in micro-electro-mechanical system manufacturing, and integrated circuit manufacturing.

Description

technical field [0001] The invention relates to an airtight sintering device for a glass tube and a MEMS chip, which is suitable for the packaging process of a resonant pressure sensor in the manufacture of a micro-electromechanical system (MEMS) and the field of integrated circuit manufacturing. Background technique [0002] Micro-Electro-Mechanical Systems (MEMS) integrates micro-mechanical structures, sensors, actuators and control processing circuits, which greatly improves stability and reliability. The packaging of MEMS is significantly different from the packaging of integrated circuits. Its packaging requires airtight packaging, vacuum packaging, and the ability to sense external information. [0003] For the packaging process of high-precision resonant pressure sensors, the current conventional method is: use glass paste as the adhesive, use a screen mold to make graphics, apply the glass paste on the chip to form an annular paste ring, and pre-process Sintering, v...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81C1/00
Inventor 兰贵明张正元梅勇
Owner NO 24 RES INST OF CETC
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