Airtight sintering device of glass tube and MEMS chip

A technology for sintering device and glass tube, which is applied in microstructure devices, manufacturing microstructure devices, decorative arts, etc., can solve problems such as the inability to effectively control the vacuum degree of vacuum microcavity
CN102358616BActive Publication Date: 2014-04-30NO 24 RES INST OF CETC
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
NO 24 RES INST OF CETC
Publication Date
2014-04-30

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Abstract

The invention discloses an airtight sintering device of glass tubes and MEMS chips, which comprises a main frame, a heating furnace body, a lifting adjusting member, and a lifting pressure adjusting handle, a stop valve, an air exhaust connecting member, and the like. In the device of the invention, two MEMS chips are sintered together with a glass tube; the glass tube is connected to a vacuum-pumping device for vacuum pumping; the glass tube is sintered together with two MEMS chips through glass powder so as to form a vacuum microcavity; the invention solves the problem in traditional devices that organic gas which is generated during glass slurry sintering and is released into the vacuum microcavity can not be removed; the vacuum degree is up to 5*10-5 Pa, and the qualified rate of high-precision resonance-type pressure sensors is increased. The invention is applicable to fields of packaging technology of resonance-type pressure sensors in micro-electro-mechanical system manufacturing, and integrated circuit manufacturing.
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Description

technical field

[0001] The invention relates to an airtight sintering device for glass tubes and MEMS chips, which is suitable for the packaging process of resonant pressure sensors in the manufacture of micro-electromechanical systems (MEMS) and the field of integrated circuit manufacturing. Background technique

[0002] Micro-electromechanical system (MEMS) integrates micro-mechanical structures, sensors, actuators and control processing circuits, which greatly improves stability and reliability. The packaging of MEMS is significantly different from the packaging of integrated circuits. Its packaging requires airtight packaging, vacuum packaging, and the ability to sense external information.

[0003] For the packaging process of high-precision resonant pressure sensors, the current conventional method is: use glass paste as the adhesive, use a screen mold to make graphics, apply the glass paste on the chip to form an annular paste ring, and pre-process Sintering, volatil...

Claims

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