Method for testing bending fatigue reliability of low dimensional conducting material

Abstract

The invention relates to the establishment of a system and method for testing the bending fatigue reliability of a low dimensional conducting material, in particular to a system and method for testing the bending fatigue reliability of a low dimensional conducting material. The problems that the fatigue life measurement error of the conducting film material is great, the crack initiation life can not be accurately measured and the like existing in the prior art are solved. The test system comprises an electromagnetic driving part, a fatigue loading and measurement part and a detection and recording part. The system provides a function and test method for testing the dynamic bending fatigue properties of various materials, and meanwhile, the resistance variation of tested samples can be monitored, analyzed and recorded in real time. The information such as fatigue life, crack initiation and propagation life and the like of various tested conducting samples can be accurately obtained through the recorded resistances. By using the system, the fatigue property experiment can be carried out on various tested conducting samples simultaneously, the resistance value of each tested conducting sample can be recorded and analyzed in real time, and the experiment is simple and quick to operate.

Description

technical field

[0001] The present invention relates to the establishment of a test system and a test method for the fatigue performance of low-dimensional conductive materials, specifically a test system for the bending fatigue reliability of low-dimensional conductive materials, and the acquisition and development of crack initiation and propagation information in the tested sample. Test methods for fatigue life of materials. Background technique

[0002] Low-dimensional conductive thin film materials are widely used in the fields of electronic information, industry and medicine, such as microelectronic trigger switches in micro / nano electromechanical systems (MEMS / NEMS), and materials for various cardiovascular stents. The above-mentioned devices are subjected to complex alternating fatigue loads such as reciprocating bending, stretching or torsion during actual service. Understanding the fatigue properties of conductive thin film materials in devices is of great help to ...

Examples

Embodiment 1

[0063]The metal nickel foil with a thickness of 50 μm is mechanically polished and electrolytically polished, and the thickness of the tested conductive sample 5 is 34 μm, which is cut into a U-shaped small-scale tested conductive sample 5-1, and the sample is fixed on the On the sample fixture 6, the effective length of the cantilever beam is selected to be 3mm, and the assembly diagram of the sample and the sample fixture 6 device is shown in Figure 2. Before the fatigue test, the tensile stress-strain curve of the nickel foil was obtained by the uniaxial tensile test to obtain the constitutive relationship in the finite element simulation. Using the constitutive relationship, the maximum strain at the root of the sample was calculated to be 1.0921%. The sine wave with a frequency of 50 Hz is selected as the fatigue waveform of the load, the amplitude of the sample is 2 mm, and the tension and compression symmetrical fatigue loading is adopted. From the real-time resistance ...

Embodiment 2

[0065] Bend the drawn pure copper wire with a diameter of 25 μm into an arc, and fix its two ends on the fixture 6, select the length of the cantilever beam of the filament to be 3.5mm, and the assembly diagram is as follows Figure 4 shown. Before the fatigue test, the tensile stress-strain curve of the copper wire was obtained by the uniaxial tensile test to obtain the constitutive relationship in the finite element simulation. Using the constitutive relationship, the maximum strain at the root of the sample was calculated to be 8.5%. The sine wave with a frequency of 50 Hz is selected as the fatigue waveform of the load, the amplitude of the sample is 2 mm, and the tension and compression symmetrical fatigue loading is adopted. A multi-channel digital multimeter is used to collect the resistance value of the sample during the fatigue test. From the real-time resistance value of the sample measured during the fatigue test, the relative change rate of the sample resistance i...

technical field

[0001] The present invention relates to the establishment of a test system and a test method for the fatigue performance of low-dimensional conductive materials, specifically a test system for the bending fatigue reliability of low-dimensional conductive materials, and the acquisition and development of crack initiation and propagation information in the tested sample. Test methods for fatigue life of materials. Background technique

[0002] Low-dimensional conductive thin film materials are widely used in the fields of electronic information, industry and medicine, such as microelectronic trigger switches in micro / nano electromechanical systems (MEMS / NEMS), and materials for various cardiovascular stents. The above-mentioned devices are subjected to complex alternating fatigue loads such as reciprocating bending, stretching or torsion during actual service. Understanding the fatigue properties of conductive thin film materials in devices is of great help to ...

Examples

Embodiment 1

[0063]The metal nickel foil with a thickness of 50 μm is mechanically polished and electrolytically polished, and the thickness of the tested conductive sample 5 is 34 μm, which is cut into a U-shaped small-scale tested conductive sample 5-1, and the sample is fixed on the On the sample fixture 6, the effective length of the cantilever beam is selected to be 3mm, and the assembly diagram of the sample and the sample fixture 6 device is shown in Figure 2. Before the fatigue test, the tensile stress-strain curve of the nickel foil was obtained by the uniaxial tensile test to obtain the constitutive relationship in the finite element simulation. Using the constitutive relationship, the maximum strain at the root of the sample was calculated to be 1.0921%. The sine wave with a frequency of 50 Hz is selected as the fatigue waveform of the load, the amplitude of the sample is 2 mm, and the tension and compression symmetrical fatigue loading is adopted. From the real-time resistance ...

Embodiment 2

[0065] Bend the drawn pure copper wire with a diameter of 25 μm into an arc, and fix its two ends on the fixture 6, select the length of the cantilever beam of the filament to be 3.5mm, and the assembly diagram is as follows Figure 4 shown. Before the fatigue test, the tensile stress-strain curve of the copper wire was obtained by the uniaxial tensile test to obtain the constitutive relationship in the finite element simulation. Using the constitutive relationship, the maximum strain at the root of the sample was calculated to be 8.5%. The sine wave with a frequency of 50 Hz is selected as the fatigue waveform of the load, the amplitude of the sample is 2 mm, and the tension and compression symmetrical fatigue loading is adopted. A multi-channel digital multimeter is used to collect the resistance value of the sample during the fatigue test. From the real-time resistance value of the sample measured during the fatigue test, the relative change rate of the sample resistance i...

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