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Dual components condensed type room temperature cured high conductive silicone rubber adhesive and application method thereof

A room temperature curing, condensation type technology, used in conductive adhesives, non-polymer adhesive additives, adhesives, etc., can solve the problem of inability to deep cure, and achieve the effect of good elasticity, wide application range and excellent electrical conductivity

Active Publication Date: 2014-04-02
JIANGSU NANOWELL ADVANCED MATERIALS SCI&TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the conductive silicone rubber is cured by absorbing moisture in the air, so it has the common disadvantage of all RTV-1 silicone rubbers, that is, it cannot be cured deeply.

Method used

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  • Dual components condensed type room temperature cured high conductive silicone rubber adhesive and application method thereof

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0039] Production of component A: In a dry and clean container, uniformly mix the following components: 1000 parts by weight of spherical copper powder with a diameter of 1000nm, 100 parts by weight of hydroxyl-terminated polysilicon with a viscosity of 1000cp and a hydroxyl content of 0.10%. A mixture of oxanes, 10 parts by weight of dibutyltin diacetate catalyst. After mixing, a viscous liquid with a viscosity of 100000cp~150000cp is obtained and stored in a sealed container.

[0040] Production of component B: In a dry and clean container, uniformly mix the following components: 1000 parts by weight of spherical copper powder with a diameter of 1000nm, 100 parts by weight of hydroxyl-terminated polysilicon with a viscosity of 1000cp and a hydroxyl content of 0.10%. A mixture of oxanes, 10 parts by weight of fumed silica, and 10 parts by weight of methyltriethoxysilane curing agent. After mixing, a viscous liquid with a viscosity of 100000cp~150000cp is obtained and stored ...

example 2

[0043] Preparation of component A: In a dry and clean container, uniformly mix the following components: 700 parts by weight of flaky silver powder with a diameter of 5000nm, 100 parts by weight of hydroxyl-terminated polysilicon with a viscosity of 10000cp and a hydroxyl content of 0.04%. The mixture of oxane, the dibutyltin dilaurate catalyst of 1 weight part. After mixing, a viscous liquid with a viscosity of 80000cp~120000cp is obtained and stored in a sealed container.

[0044] Production of component B: In a dry and clean container, uniformly mix the following components: 700 parts by weight of flaky silver powder with a diameter of 5000nm, 100 parts by weight of hydroxyl-terminated polysilicon with a viscosity of 10000cp and a hydroxyl content of 0.04%. A mixture of oxanes, without functional fillers, and 20 parts by weight of tetraethyl silicate curing agent. After mixing, a viscous liquid with a viscosity of 80000cp~120000cp is obtained and stored in a sealed contain...

example 3

[0047] Production of component A: In a dry and clean container, uniformly mix the following components: 800 parts by weight of spherical silver-coated glass powder with a diameter of 200nm, 100 parts by weight of hydroxyl-terminated glass powder with a viscosity of 3000cp and a hydroxyl content of 0.08%. Mixture of polysiloxanes, 5 parts by weight of dibutyltin (β-diketone ester) catalyst. After mixing, a viscous liquid with a viscosity of 150000cp~190000cp is obtained and stored in a sealed container.

[0048] Production of component B: In a dry and clean container, uniformly mix the following components: 800 parts by weight of spherical silver-coated glass powder with a diameter of 200nm, 100 parts by weight of hydroxyl-terminated glass powder with a viscosity of 3000cp and a hydroxyl content of 0.08%. A mixture of polysiloxanes, 5 parts by weight of KH-560, 5 parts by weight of fumed silica, and 5 parts by weight of vinyltriethoxysilane curing agent. After mixing, a viscou...

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Abstract

The invention provides a dual components condensed type room temperature cured high conductive silicone rubber adhesive. The adhesive is divided into a component A and a component B. The component A is composed of a metal-based conductive filling material, a hydroxy terminiated polysiloxanes mixture and a catalyst; the components B is composed of the metal-based conductive filling material, the hydroxy terminiated polysiloxanes mixture and a curing agent. The invention has the advantages that the conductive performance is excellent, the solidification process is not influenced by the glue layer thickness, the phenomenon of catalyst poisoning is not generated, the conductivity is high, the cohesiveness and the sealing are strong, the elasticity is good and the application scope is wide. The adhesive is used for bonding metal, semiconductor, ITO electro-conductive glass and the like to form a conductive-sealant integral body, especially used for package application of a AB rubber pipe. The invention also provides an application method of the silicone rubber adhesive. The method comprises the following steps: fully mixing the component A and the component B according to ratio of 1:1, curing and molding under the room temperature condition. The method has the advantages of room temperature solidification, no requirement of water and gas absorption, deep solidification realization and dual components ratio with 1:1, and is convenient for package application of the AB rubber pipe.

Description

technical field [0001] The invention belongs to the technical field of chemical materials, in particular to a two-component condensation type room temperature curing high-conductivity silicone rubber adhesive and a preparation method thereof. Background technique [0002] With the development of the electronics industry, more and more attention has been paid to the electromagnetic shielding of electronic circuits. A large number of radio products such as mobile phones, GPS navigators, wireless network cards, etc. will generate electromagnetic radiation, which will interfere with the normal signals inside other electronic systems and pose a threat to the external ecological environment. For this purpose, the electronic circuit is generally packaged in a conductive shell to form an electromagnetic shielding whole. However, at the panel seams of the enclosure, the shielding performance is often reduced due to poor conductivity. Therefore, it is necessary to seal and connect t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J183/06C09J11/04C09J9/02
Inventor 汤砚蔚姜清奎常振宇丁渐宝
Owner JIANGSU NANOWELL ADVANCED MATERIALS SCI&TECH
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