Electroplating electric-conducting device for integrated circuit lead frame

A technology of lead frames and integrated circuits, applied in circuits, electrical components, electrolytic processes, etc., can solve the problems of uneven distribution of current density, uneven thickness of silver layer, increased production costs, etc., achieve uniform distribution of current density, reduce silver The loss and the effect of reducing production costs

Inactive Publication Date: 2012-03-21
顺德工业(江苏)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Its disadvantages are: due to the energization on both sides of the lead frame, the current density distribution in the lead frame is uneven, which will lead to uneven thickness of the silver layer on the lead frame, and will also increase the loss of silver. With the international The continuous rise of silver price is equal to the increase of production cost

Method used

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  • Electroplating electric-conducting device for integrated circuit lead frame
  • Electroplating electric-conducting device for integrated circuit lead frame

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Embodiment Construction

[0011] The electroplating conductive device of the integrated circuit lead frame of the present invention will be further described in detail through specific embodiments below.

[0012] Such as figure 1 As shown, the electroplating conductive device of the integrated circuit lead frame includes an upper mold 1 and a lower mold 2, the upper mold 1 is provided with a conductive strip 3, and the conductive strip 3 is provided with two binding posts 4, and the two conductive strips 3 At least three pins 5 are respectively arranged along the lateral direction, and the ends of the pins 5 extend to the bottom of the upper mold 1 . In this embodiment, six pins 5 are arranged on both sides of the conductive strip 3 along the transverse direction. An anode plate 7 is arranged in the lower mold 2 .

[0013] The working principle of the present invention is: when the integrated circuit lead frame 6 is electroplated, the lead frame 6 is first sent between the upper die 1 and the lower d...

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Abstract

The invention relates to an electroplating electric-conducting device for an integrated circuit lead frame, which comprises an upper die and a lower die, wherein an electric-conducting strip is arranged in the upper die, two binding posts are arranged on the electric-conducting strip, each electric-conducting strip is provided with at least three pins arranged along the transverse direction, the end parts of the pins extend to the bottom of the upper die, and an anode plate is arranged in the lower die. The electroplating electric-conducting device is suitable for conducting electroplating on the integrated circuit lead frame, and can lead current density in the lead frame to be distributed uniformly, so that a silver layer on the lead frame has uniform thickness, the consumption of silver is reduced, and further the production cost is lowered.

Description

technical field [0001] The invention relates to an electroplating conductive device for an integrated circuit lead frame. Background technique [0002] Integrated circuit lead frames are the basic components in the manufacture of integrated circuit semiconductor components. In order to meet the requirements of manufacturing integrated circuit semiconductors, the local area of ​​the surface of the integrated circuit lead frame needs to be electroplated with metallic silver. The silver layer needs to be fine and uniform, otherwise it will affect the life of the semiconductor components of the integrated circuit. [0003] At present, when the integrated circuit lead frame is electroplated, the lead frame is first sent between the upper mold and the lower mold, the lead frame is pressed by the upper mold and the lower mold, and electricity is applied to both sides of the lead frame, and then the spraying solution starts electroplating. After electroplating, the products are wa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D7/00C25D17/00H01L23/495
Inventor 倪兵
Owner 顺德工业(江苏)有限公司
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