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Low temperature fireable paste composition for forming an electrode or wiring

A composition and wiring technology, which is applied to the formation of electrical connection of printed elements, conductive materials dispersed in non-conductive inorganic materials, circuits, etc., can solve the problem of reducing the adhesion and fusion of Ag particles, and difficult to achieve high resolution. Electrode pattern, slow curing speed, etc., to achieve the effect of excellent printing characteristics, excellent resistivity characteristics, and excellent curing degree

Inactive Publication Date: 2012-03-21
DONGJIN SEMICHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] When such a conventional paste composition is heated and cured, a urethane compound is generated, and the generated urethane compound is a conductive powder, and the main problem is that the adhesion and weldability of the Ag particles used are greatly reduced.
In addition, due to the slow curing speed of this conventional paste composition, the widening phenomenon of the line width is caused, and it is difficult to realize a high-resolution electrode pattern (refer to Korean Patent Publication No. 10-2006-0049996 and No. 10-2008 -0024444, and Japanese Patent Laid-Open Nos. 2005-268239, 2006-48149, and 2007-224191)

Method used

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  • Low temperature fireable paste composition for forming an electrode or wiring

Examples

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Comparison scheme
Effect test

Embodiment 1～3、 and comparative example 1 and 2

[0047] The components described in the following Table 1 were used in corresponding amounts, and were mixed with a three-roll kneader to manufacture the target paste composition.

[0048] Next, resistivity, viscosity change, resolution, aspect ratio, substrate adhesion, strength after firing, etc. were measured for the produced paste composition, and the physical property measurement results are also shown in Table 1.

[0049] Table 1

[0050]

[0051] As can be seen from the above Table 1, the paste compositions of the present invention produced in Examples 1 to 3, compared with the compositions produced in Comparative Examples 1 and 2, not only exhibit significantly superior resistivity characteristics, stability, strength and Substrate adhesion, high resolution and high aspect ratio electrode patterns can also be achieved.

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Abstract

The present invention relates to a paste composition for forming an electrode or wiring. The paste composition for forming an electrode or wiring according to the present invention comprises: a) conductive powder, b) a cellulose-based binder, c) an acrylate-based monomer, d) a radical polymerization initiator, and e) a solvent. As compared to conventional paste compositions, the paste compositionof the present invention is fireable at a low temperature and has superior hardness, electrical resistivity, and stability properties, and therefore has a valuable use in forming an electrode or wiring for a solar cell, RFID (radio frequency identification), or a PCB (printed circuit board).

Description

technical field [0001] The present invention relates to a paste composition for forming electrodes or wiring that can be fired at a low temperature, especially can be fired at a low temperature and has excellent resistivity characteristics and excellent stability, so that it can be used in solar cells, RFID (radio A thermosetting paste composition usefully used in the formation of Radio Frequency Identification) or PCB (Printed Circuit Board, Printed Circuit Board) electrodes or wiring, and a method of forming electrodes or wiring using the same. Background technique [0002] Conventional paste compositions for forming electrodes and wiring are produced by mixing conductive powder, epoxy-based binders, curing agents, solvents, and the like. [0003] When such a conventional paste composition is heated and cured, a urethane compound is generated, and the generated urethane compound is a conductive powder, which mainly has the problem that the adhesion and weldability of the A...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/22H01L31/042H05K3/40
CPCH01L31/022425H01B1/22H05K1/095Y02E10/50H01L31/04H05K3/40
Inventor 黄建镐郑镛埈高旼秀郑美惠
Owner DONGJIN SEMICHEM CO LTD
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