Super thin stainless steel carrier plate and device for polishing sapphire LED (Light-emitting Diode) substrate
A stainless steel and sapphire technology, applied in metal processing equipment, grinding devices, grinding machine tools, etc., can solve the problems of high loss, difficult to meet customer requirements, low efficiency, etc.
Inactive Publication Date: 2012-04-04
上海双明光学科技有限公司
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Problems solved by technology
[0004] The existing double-sided grinding and polishing machinery and equipment have low efficiency and high loss for processing crystal sheets with a thickness of less than 0.3 mm, and it is difficult to meet customer requirements.
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[0020]In order to further understand the buffer device of the back-pressure double-sided grinding and polishing machine, the following analysis is based on the drawings: the back-pressure double-sided grinding and polishing machine includes a compressed air machine, a cylinder 1, a piston 2, a connecting rod 3, and a central shaft 4. Upper grinding disc 5, connecting body 6, connecting bolt 7, lower grinding disc 8. The aerodynamic force generated by the compressed air machine is transmitted to the cylinder 1 through the pipeline, and enters the lower steam chamber during counter-pressure operation, and the piston 2 moves upward after being compressed, driving the connecting rod 3 to move upward, and the connecting rod 3 and the central shaft 4. Coaxial operation, and then the upper grinding disc 5. Also move up. If the back pressure continues to increase at this time, the upper grinding disc will continue to rise. Connector 6, is placed above the upper grinding disc, and is c...
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Abstract
The invention is used for LED (Light-emitting Diode) parts and belongs to manufacturing and processing field of precise instruments and crystals. The back pressure type two-sided lapping polisher is to solve the problems of the strength of a special super thin carrier plate for polishing a sapphire LED substrate and the anticorrosion. In order to solve the technical problems, the special super thin stainless steel carrier plate for polishing the sapphire LED substrate is made of imported corrosion-resisting 316L stainless sheet steel. The super thin stainless steel carrier plate is in a disk shape, and the circumference of the super thin stainless steel carrier plate is in a tooth shape, so that the rotating speed of a grinding panel and the carrier plate can be limited, the rotating center of the carrier plate is located, and the carrier plate is meshed with internal gears around a base of a double-faced grinding and polishing machine to be operated. The disk face is provided with a plurality of carrier workpiece grinding face round positions which are evenly distributed, the sapphire LED substrate is put into the carrier workpiece grinding face round positions and is manufactured through grinding and polishing. In order to meet the requirements of workpieces with different specifications, stainless steel grinding and polishing carrier plates with various specifications are developed and manufactured, so that the requirements of workpieces can be met.
Description
technical field [0001] The invention relates to a special ultra-thin stainless steel carrier disk used in the process of processing LED components and sapphire epitaxial substrates for gallium nitride GAN growth, and belongs to the field of precision instruments and crystal manufacturing and processing. [0002] The invention also relates to a back-pressure double-sided grinding and polishing machine, belonging to the field of high-precision mechanical equipment manufacturing and processing, especially the processing of ultra-thin crystals, and a polishing machine with a buffer device. Background technique [0003] With the rapid development of optoelectronic technology, gallium nitride as a blue light source has become the main technical component of current high-brightness LED products. As the supporting growth sapphire, it has become one of the most important substrate materials and has great demand in domestic and foreign markets. In the Twelfth Five-Year Development Pl...
Claims
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IPC IPC(8): B24B37/34
Inventor 姚建明
Owner 上海双明光学科技有限公司