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Manufacturing process of single panel gold finger

A manufacturing process and gold finger technology, applied in the field of single-panel gold finger manufacturing process, can solve problems such as fracture, low production yield, wrinkle, etc., and achieve the effect of wide application range and improved production yield

Active Publication Date: 2012-04-25
博罗县精汇电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The copper foil base material used for single-sided double-sided exposed copper gold finger boards is generally thin pure copper foil. In this production process, after the film is removed from the etching circuit of the product, the fingers at the window opening of the bottom cover film will become hollow fingers. In the process of laminating the top cover film, it is easy to deform, wrinkle or even break the hollow fingers when passing the horizontal line equipment or manual operation
This is also the main reason for the low production yield of single-sided double-sided exposed copper gold fingers in the industry.

Method used

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  • Manufacturing process of single panel gold finger
  • Manufacturing process of single panel gold finger
  • Manufacturing process of single panel gold finger

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Embodiment Construction

[0021] Below in conjunction with accompanying drawing, preferred embodiment of the present invention is described in further detail:

[0022] figure 1 1 is the top cover film layer, 2 is the pure copper foil layer, and 3 is the bottom cover film layer.

[0023] figure 2 2 is the pure copper foil layer, 3 is the bottom cover film layer, and 4 is the high temperature resistant PI tape. Paste 4 on the window opening of the bottom cover film of 3, laminate with 2, and then laminate and press on the copper foil, tear off 4 after pressing, and then cover the top cover film layer 1 and the bottom layer Surface treatment is carried out at the window opening of the film layer 3 until the product is molded and packaged for shipment.

[0024] Such as image 3 As shown, it is the manufacturing process of the single-sided gold finger in the present invention. The gold finger includes: a top cover film layer 1 arranged on the upper layer, a pure copper foil layer 2 in the middle, and a...

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Abstract

The invention provides a manufacturing process of a single panel gold finger. The gold finger comprises: a top cover membrane layer arranged on an upper layer, a pure copper foil layer arranged in the middle and a bottom cover membrane layer arranged on the bottom. An opening is arranged on the bottom cover membrane layer. The manufacturing process comprises the following steps: a joint step: sticking a PI adhesive tape which is larger than the opening on the opening of the cover membrane layer; a laminated step: laminating the gold finger and the PI adhesive tape together, sticking the top cover membrane layer on the laminated product and then carrying out lamination; an evulsion step: evulsing the laminated PI adhesive tape; a processing step: processing on the top cover membrane layer and the opening of the bottom cover membrane layer. By using the manufacturing process of the invention, deformation and corrugation of the hollow finger during a process of after etching line stripping membrane to laminated top cover membrane in this kind of products can be avoided. A production yield rate of the products can be substantially increased.

Description

technical field [0001] The invention relates to a manufacturing process of a single-sided gold finger, in particular to a manufacturing process of a single-sided gold finger capable of improving yield and yield. Background technique [0002] At present, the process of producing single-sided double-sided exposed copper gold finger boards in the industry is: blanking → drilling → pasting of the bottom cover film (the cover film has openings) → lamination → silk screen printing anti-etching oil (the bottom cover film is opened) window) → paste dry film, exposure → etch circuit → paste top cover film (cover film has openings) → lamination → gold. [0003] The copper foil base material used for single-sided double-sided exposed copper gold finger boards is generally thin pure copper foil. In this production process, after the film is removed from the etching circuit of the product, the fingers at the window opening of the bottom cover film will become hollow fingers. In the proc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/40
Inventor 叶夕枫
Owner 博罗县精汇电子科技有限公司
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