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Production method for squashed patch plastic package diode based on axial diode production line

An axial diode and production method technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of wasting time and increasing costs, and achieve the goal of reducing production costs, meeting social needs, and saving money and time. Effect

Inactive Publication Date: 2012-05-02
CHENGDU ZHONGKE PRECISION MOLD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this patent, it only involves the technical solution to improve the utilization rate of copper sheets, and there is no description about the production of SMD diodes by using the axial plastic-sealed diode production line. Cost-increasing, time-wasting issues

Method used

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  • Production method for squashed patch plastic package diode based on axial diode production line
  • Production method for squashed patch plastic package diode based on axial diode production line
  • Production method for squashed patch plastic package diode based on axial diode production line

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Embodiment Construction

[0016] Below in conjunction with accompanying drawing, the present invention is described in further detail:

[0017] The invention includes the following processes: chip testing→assembly with lead frame→sintering→pickling→gluing→baking→plastic sealing→post-curing→waste removal→flattening→rib cutting and forming→electroplating→printing test→external inspection→packaging→ QA inspection→warehousing. In the process, the chip testing, assembly with lead frame, sintering, pickling, gluing, baking, post-curing, electroplating, printing test, external inspection, packaging, QA inspection and storage are carried out on the axial diode production line Complete, the plastic sealing is completed on the plastic sealing mold, the waste removal is completed on the waste removal mold, the flattening is completed on the flattening mold, and the rib cutting and forming is completed on the rib cutting forming mold.

[0018] As can be seen from the above, the focus of the present invention is t...

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Abstract

The invention discloses a production method for a squashed patch plastic package diode based on an axial diode production line. The production method comprises the following flows of: chip testing; assembling with a lead frame; sintering; acid cleaning; surface sizing; baking; plastic packaging; post curing; waste removing; squashing; molding by trimming; electroplating; lettering testing; external inspecting; packaging; QA (quality assurance) inspecting; and warehousing. The conventional axial diode production line is used, and through mold matching processes such as plastic package and the like, the production of the squashed patch plastic package diode is realized, and another expensive special production line of the squashed patch plastic package diode is not needed to be purchased; and a large number of the squashed patch plastic package diodes can be produced to meet social requirements, a lot of money and time are saved for enterprises, and the production cost can be reduced.

Description

technical field [0001] The invention relates to a production method of a flattened patch plastic-sealed diode, in particular to a production method of a flattened patch plastic-sealed diode based on an axial diode production line. Background technique [0002] Among many electronic components, axial plastic encapsulated diodes are the basic components and are widely used in various fields. However, with the need for miniaturization and automated production of electronic products, the demand for SMD plastic-encapsulated diodes is increasing year by year. Since the SMD plastic-encapsulated diode production line is completely different from the axial plastic-encapsulated diode production line, the only way to upgrade products is to reinvest Another SMD plastic-encapsulated diode production line requires a lot of money (about 2 million for a production line) and time. This not only hinders enterprises from providing a large number of SMD plastic-encapsulated diodes, which canno...

Claims

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Application Information

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IPC IPC(8): H01L21/329H01L21/56
Inventor 黄世强李儒辉黄玲
Owner CHENGDU ZHONGKE PRECISION MOLD
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