Halogen-free low dielectric resin composition and prepreg and copper clad laminate made of same
A resin composition, low dielectric technology, used in synthetic resin layered products, circuit substrate materials, layered products, etc., can solve the problem of poor copper foil adhesion, general solvent resistance, glass transition temperature, heat resistance It can meet the problems of high frequency, excellent dielectric properties, and improve crosslinking density.
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[0036] The halogen-free low-dielectric resin composition of the present invention, by weight of organic solids, comprises:
[0037] 5-90 parts by weight of epoxidized polybutadiene resin;
[0038] 10-90 parts by weight of benzoxazine resin;
[0039] 10-90 parts by weight of epoxy resin;
[0040] 1-50 parts by weight of curing agent;
[0041] 10-50 parts by weight of organic flame retardant;
[0042] 0.01-1 parts by weight of curing accelerator;
[0043] 0.1-10 parts by weight of initiator; and
[0044] 10-100 parts by weight of filler.
[0045] The epoxidized polybutadiene resin comprises at least one of the compounds shown in the following structural formula:
[0046] (Formula 1)
[0047] Formula 1 is cis-1, 4 epoxidized polybutadiene, trans-1, 4 epoxidized polybutadiene, cis-1, 4-terminal hydroxyl epoxidized polybutadiene, trans-1, 4-terminal Hydroxyl epoxidized polybutadiene, cis-1, 4-terminal carboxyl epoxidized polybutadiene, or trans-1, 4-terminal carboxyl epox...
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