High-frequency equivalent circuit used for via holes of BGA (ball grid array) substrate
A technology of equivalent circuit and via hole, which is applied in the field of effective circuit, can solve problems such as pin signal integrity problems, and achieve the effect of reasonable structure
Inactive Publication Date: 2012-06-20
NANTONG UNIVERSITY
View PDF2 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0002] As the operating frequency of integrated circuits is getting higher and higher, modern integrated circuit packages must not only meet the basic electrical connection functions, but also be able to solve the problems of high frequency / high speed and the increase in the number of pins due to the development of integrated circuit chip technology. Signal Integrity Issues Caused by
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0014] A high-frequency equivalent circuit for BGA substrate vias is characterized in that: it is a high-frequency equivalent circuit for Π-type substrate vias, including first and second ports (i.e. port 1, port 2), The positive pole of the first port and the positive pole of the second port are connected with a resistance Rs representing the interconnection loss of the via signal channel and an inductance Ls representing the parasitic inductance value of the via signal channel, and the resistance Rs is connected in series with the inductance Ls; the first The capacitor Cd1 is connected in parallel with the first resistor Rd1, and one end is connected between the positive pole of the first port and the resistor Rs, and the other end is connected to the negative pole of the first port; the second capacitor Cd2 is connected in parallel with the second resistor Rd2, and one end is connected to the positive pole of the second port Between and the inductor Ls, the other end is conn...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention discloses a high-frequency equivalent circuit used for via holes of a BGA (ball grid array) substrate. A resistor Rs and an inductor Ls are connected between a positive electrode of a first port and a positive electrode of a second port, the resistor Rs is used for indicating interconnection consumption of via-hole signal channels, the inductor Ls is used for indicating stray inductance values of the via-hole signal channels, and the resistor Rs and the inductor Ls are connected in series. One end of a first capacitor Cd1 is connected between the positive electrode of the first port and the resistor Rs while the other end thereof is connected with a negative electrode of the first port after the first capacitor is connected with a first resistor Rd1 in parallel. One end of a second capacitor Cd2 is connected between the positive electrode of the second port and the inductor Ls while the other end thereof is connected with a negative electrode of the second port after the second capacitor Cd2 is connected with a second resistor Rd2 in parallel. The high-frequency equivalent circuit is reasonable in structure and applicable to design and use of high-frequency high-speed integration circuits and has significance to chip-package integrated design, and equivalent circuit models of the via holes can be easily built.
Description
technical field [0001] The invention relates to a high-frequency equivalent circuit for BGA substrate via holes. Background technique [0002] As the operating frequency of integrated circuits is getting higher and higher, modern integrated circuit packages must not only meet the basic electrical connection functions, but also be able to solve the problems of high frequency / high speed and the increase in the number of pins due to the development of integrated circuit chip technology. cause signal integrity problems. Compared with the previous packaging technologies such as DIP, QFN, and QFP, the advanced BGA packaging technology effectively reduces the package parasitic parameters, but how to minimize the impact of package parasitic parameters on high-frequency and high-speed circuits requires the establishment of package interaction The equivalent circuit model of the connection structure enables the circuit designer to take into account the package parasitic parameter fac...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/50
Inventor 孙玲杨玲玲孙海燕王圣龙
Owner NANTONG UNIVERSITY