Unlock instant, AI-driven research and patent intelligence for your innovation.

Heat transfer arrangement and electronic housing comprising a heat transfer arrangement

A heat transfer and shell technology, applied in the field of electronic component shells, can solve the problems of controlled cooling, no disclosure, etc.

Active Publication Date: 2012-06-20
TELEFON AB LM ERICSSON (PUBL)
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, WO99 / 60709 does not disclose how cooling can be controlled in a thermosiphon cooling system

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Heat transfer arrangement and electronic housing comprising a heat transfer arrangement
  • Heat transfer arrangement and electronic housing comprising a heat transfer arrangement
  • Heat transfer arrangement and electronic housing comprising a heat transfer arrangement

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0027] The present invention will be described more fully with reference to the accompanying drawings, in which example embodiments are shown. However, the invention should not be construed as limited to the embodiments set forth herein. The disclosed features of the example embodiments may be combined as readily understood by one of ordinary skill in the art to which this invention pertains. Like reference numbers refer to like elements throughout.

[0028] Well-known functions or constructions may not be described in detail for brevity and / or clarity.

[0029] figure 1 A heat transfer device 100 according to an example embodiment is schematically shown. The refrigerant circuit 102 includes an evaporator 104, a condenser 106 and piping. The conduits include a first conduit 108 and a second conduit 110 . Inside the refrigerant circuit 102 is a refrigerant such as R134a, which is the name of 1,1,1,2-Tetrafluoroethane, which has the chemical formula CH2FCF3. Under certain ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A heat transfer arrangement for heat exchange between an inside of an electronic component housing and an ambient environment. The heat transfer arrangement comprises a refrigerant circuit with an evaporator a condenser and conduits (202). A refrigerant is arranged to self-circulate in a refrigerant flow in the refrigerant circuit. A flow control device (124) comprises a movable member (206) adapted to control the refrigerant flow. The movable member (206) affects a through flow area of one of the conduits (202). The movable member (206) is adapted to move in response to a pressure change inside the refrigerant circuit by being affected from a first side by a refrigerant pressure inside the refrigerant circuit and from a second side by a spring force such that the refrigerant flow is changed.

Description

technical field [0001] According to the preamble of claim 1 , the invention relates to a heat transfer device comprising a refrigerant circuit. The invention also relates to an electronic component housing comprising such a heat transfer device. Background technique [0002] Heat transfer systems utilizing refrigerant circulation through evaporators and condensers are well known. Heat transfer systems in which the refrigerant self-circulates (ie, gravity and buoyancy are the forces driving the refrigerant's circulation), are sometimes referred to as thermosiphons. [0003] Many electronic component housings need to be cooled due to the heat generated by the electronic components within the housing. WO99 / 60709 discloses a method and apparatus for cooling electronic components of a radio base station installed in an elevated position. The evaporator of the thermosiphon cooling system is in thermal contact with the heat generating electronic components to be cooled. The con...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): F28D15/02F28D15/06H04B1/036H05K7/20
CPCF28D15/06G05D23/125H05K7/20327F28D15/0266H01L23/427H01L2924/0002H01L2924/00
Inventor M·克尔马克K·黑德贝格F·琼森
Owner TELEFON AB LM ERICSSON (PUBL)