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MEMS (Micro Electro Mechanical System) technology-based thermal diffusivity sensor chip and manufacturing method thereof

A technology for sensor chips and thermal diffusivity, applied in microstructure technology, technology for producing decorative surface effects, decorative art, etc., can solve the problems of too many samples, complicated equipment, and long time

Inactive Publication Date: 2012-06-27
XI AN JIAOTONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

For example, the thermal probe measurement method and the transient double-heated wire method are used to measure the thermal diffusivity. Although the above technologies can improve the measurement accuracy to a certain extent, there are still problems that require too many samples, long time or complicated equipment. Happening

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  • MEMS (Micro Electro Mechanical System) technology-based thermal diffusivity sensor chip and manufacturing method thereof
  • MEMS (Micro Electro Mechanical System) technology-based thermal diffusivity sensor chip and manufacturing method thereof
  • MEMS (Micro Electro Mechanical System) technology-based thermal diffusivity sensor chip and manufacturing method thereof

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Embodiment Construction

[0021] Below in conjunction with accompanying drawing, the thermal diffusivity sensor chip based on MEMS technology of the present invention and preparation method thereof are described in detail:

[0022] refer to figure 1 The main structure of the sensor chip of the present invention includes an SOI wafer (the SOI wafer includes a bulk silicon 11, a silicon dioxide buried layer 9 deposited on the upper surface of the bulk silicon 11, and a top silicon layer 10 deposited on the upper surface of the silicon dioxide buried layer 9) , a silicon dioxide isolation layer 3 deposited on the top silicon surface of the SOI wafer, a heater 8 and a temperature sensor 4 deposited on the upper surface of the silicon dioxide isolation layer 3, and deposited on the upper surface of the silicon dioxide isolation layer 3, The silicon nitride protective layer 2 on the upper surface of the heater and the upper surface of the temperature sensor, wherein the bulk silicon 11 of the SOI wafer is re...

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Abstract

The invention provides an MEMS (Micro Electro Mechanical System) technology-based thermal diffusivity sensor chip and a manufacturing method thereof. The sensor chip comprises a silicon dioxide isolation layer deposited on the upper surface of an SOI (Silicon On Insulator) wafer, a heater and temperature sensors deposited on the upper surface of the silicon dioxide isolation layer and formed by etching, as well as silicon nitride protective layers which are deposited on the upper surface of the silicon dioxide isolation layer, the upper surface of the heater and the upper surfaces of the temperature sensors, wherein a heat insulation cavity is etched on the SOI wafer upwards from the lower surface to the lower surface; the heater is positioned in the central position of the upper surface of the silicon dioxide isolation layer; and the temperature sensors are uniformly distributed in the radial direction taking the heater as a center. According to the sensor chip provided by the invention, the thermal conductivity factor of fluids can be measured in dozens of seconds only by means of a few microliters of sample liquid, and the measurement can be realized in a large temperature range.

Description

technical field [0001] The invention relates to a thermal diffusivity sensor chip based on MEMS (microelectronic system), in particular to a thermal diffusivity sensor chip based on MEMS technology and a preparation method thereof, which are used for measuring fluid thermal diffusivity. Background technique [0002] There are many ways to measure the thermal diffusivity of a fluid. The thermal diffusivity is an important transfer property of a fluid. To determine the thermal diffusivity of a fluid, there are generally two ways: theoretical calculation and experimental measurement. Since there is no complete theory of the packing structure of fluid molecules, the formulas and models assumed by these estimates are idealized and simplified, and do not fully conform to the complex actual situation, often resulting in large errors, and these equations are generally only applicable to Specific systems and ranges, many fluids still need experimental determination. Therefore, exper...

Claims

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Application Information

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IPC IPC(8): G01N25/20B81C1/00
Inventor 周睿蒋庄德李支康赵玉龙王晓坡刘志刚
Owner XI AN JIAOTONG UNIV
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