Device for scraping liquid tin-soldered oxide skin by semi-automatic tin immersion machine

Abstract

The invention discloses a device for scraping liquid tin-soldered oxide skin by a semi-automatic tin immersion machine, wherein the device comprises a scraper, a tin melting pool, a scraper horizontal movement mechanism and a scraper lifting mechanism; the scraper horizontal movement mechanism comprises a horizontal drive cylinder, a scraper movement crossbeam and a scarper horizontal movement guide mechanism; the scraper horizontal movement guide mechanism is arranged on the two sides of the horizontal drive cylinder; and the rear end of the scraper is fixed on the front side of one end of the scraper movement crossbeam. The scraper lifting mechanism is arranged on the lower side of a scraper lifting crossbeam and comprises a scraper lifting cylinder, an upper crossbeam, a fixed crossbeam and a scraper lifting guide mechanism; the scraper lifting guide mechanism is arranged on the two sides of the scraper lifting cylinder; and the fixed crossbeam is fixed on a worktable plate by a support block. Due to the device for scraping the liquid tin-soldered oxide skin by the semi-automatic tin immersion machine, the tin immersion quality of a pin of an electric element is guaranteed, the evaporation of tin melting liquid is reduced, the residual for the tin-soldered oxide skin is fewer, the tin soldering loss can be reduced by more than 75%, and a great amount of valuable tin soldering materials are saved.

Description

technical field [0001] The invention relates to a tin dipping device for electrical component pins, in particular to a device for removing liquid solder oxide scales before tinning electrical component pins by using a semi-automatic tin dipping machine, and belongs to the technical field of electrical appliance manufacturing. Background technique [0002] Solder a layer of tin on the pins of electrical components so that the electrical components and wires or circuit boards can be firmly connected by soldering in subsequent processes. At present, the pins of electrical components are mainly dipped in tin by a semi-automatic tin dipping machine. The solder is put into a molten tin pool heated by a semi-automatic tin dipping machine and heated to above 250°C to melt the solid solder into liquid solder, and then the semi-automatic tin dipping machine The molten tin pool rises, and the electrical component pins pre-fixed on the mold of the semi-automatic tin dipping machine are ...

AI Technical Summary

Problems solved by technology

Since the liquid solder in the molten tin pool is exposed to the air in a large area for a long time, the surface of the liquid solder is easy to oxidize, and it is necessary to regularly use a large scraper roughly equal to the width of the molten tin pool to remove the scale on the surface of the solder melt. This method removes the scale The efficiency is low, the scraped solder oxide scale residue is more, and the solder loss is larger

The pins of electrical components are easily immersed in the liquid solder with scale on the surface, which affects the tinning quality of the pins of electrical components, and the problem of poor soldering connection between electrical components and wires or circuit boards is prone to occur in subsequent processes

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