Chemical mechanical polishing equipment and preheating method for same

Abstract

Disclosed are chemical mechanical polishing equipment and a preheating method for the same. The chemical mechanical polishing equipment comprises a polishing pad, a deionized water supply pipeline, a polishing liquid supply pipeline, a polishing pad corrector, a heating device, a temperature sensor and a preheating control system, wherein the heating device is used for heating deionized water flowing into the deionized water supply pipeline, the temperature sensor close to the polishing pad is used for detecting the temperature of the polishing pad, and the preheating control system is connected with the temperature sensor and used for controlling the deionized water supply pipeline to spray the heated deionized water to the polishing pad. When the temperature detected by the temperature sensor reaches or exceeds a preset temperature, the deionized water supply pipeline is closed, the polishing liquid supply pipeline is controlled to spray polishing liquid to the polishing pad, and the polishing pad corrector is started to grind the polishing pad. Consumption of various consumables of the chemical mechanical polishing equipment in the process of preheating a machine can be reduced, so that production cost is reduced.

Description

technical field [0001] The invention relates to the field of semiconductor equipment, in particular to a chemical mechanical polishing equipment and a preheating method thereof. Background technique [0002] The chemical mechanical polishing (CMP) process is a planarization process. Since it was introduced into the integrated circuit manufacturing process in 1990, it has become a key process to promote the continuous reduction of integrated circuit technology nodes through continuous practice and development. At present, CMP has been widely used in shallow trench isolation planarization, oxide planarization, tungsten plug planarization, copper interconnection planarization and other processes. In the CMP process, before each formal wafer product is polished, it is necessary to use different types of wafer controllers for preheating and polishing on the polishing pad. The main purpose is to preheat the CMP equipment to make the temperature of the polishing pad And the state ...

AI Technical Summary

Problems solved by technology

[0004] The problem solved by the present invention is that the machine preheating process of the chemical mechanical polishing equipment in the prior art has too high loss of various consumables, which increases the production cost

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