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Assessment method of copper clad laminate mechanical properties

A technology of copper plate mechanics and copper clad laminates, applied in the field of evaluation, can solve the problem that there is no good evaluation method for the toughness of the insulating layer, there is no good evaluation method for the adhesion between the metal substrate and the adhesive layer, and it is not suitable for evaluating the metal substrate and adhesion. Problems such as the adhesion of the junction layer, to achieve the effect of improving the evaluation method

Active Publication Date: 2012-07-04
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For the evaluation of the adhesion between copper foil and the adhesive force, there are clear methods in the prior art, such as testing the peel strength of copper foil, but this method is not suitable for evaluating the adhesion between the metal substrate and the adhesive layer. For metal substrates There is still no good way to evaluate the adhesion to the adhesive layer
At the same time, the toughness of the insulating layer of the copper clad laminate is an important factor affecting the processability of the PCB, and there is currently no good evaluation method for the toughness of the insulating layer of the copper clad laminate.

Method used

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  • Assessment method of copper clad laminate mechanical properties
  • Assessment method of copper clad laminate mechanical properties
  • Assessment method of copper clad laminate mechanical properties

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] Provide the metal base copper clad laminate to be tested, refer to figure 2 As shown, it includes a metal substrate 10, a copper foil 30, and an adhesive layer 20 disposed between the metal substrate 10 and the copper foil 30. The copper foil 30 of the metal-based copper clad laminate is etched away, and the etched copper foil 30 is etched. The metal-based copper-clad laminate is cut into a sample to be tested with a width of 25 mm and a length of 250 mm. The structure of the sample to be tested is as follows: image 3 As shown, a metal substrate 10 and an adhesive layer 20 thereon are included.

[0043] like Figure 4 As shown, the sample to be tested is bent at a certain angle (30-180°) according to different diameters on the bending instrument 100 with its adhesive layer 20 facing outward, and the metal substrate 10 and the bonding of the sample to be tested are observed after bending. The delamination between the layers 20, comparative evaluation of the bonding f...

Embodiment 2

[0045] Provide the non-metal base copper clad laminate to be tested, refer to Figure 5 As shown, it includes copper foil 40 and an insulating layer 50 arranged between the copper foils 40. The non-metallic copper-clad laminate after etching the copper foil is cut into a sample to be tested with a width of 25 mm and a length of 250 mm. The structure of the sample to be tested is like Image 6 As shown, an insulating layer 50 is included, and the insulating layer 50 is an insulating layer of a non-metal-based copper clad laminate.

[0046] according to Figure 4 In the method shown, the sample to be tested is bent at a certain angle (30-180°) according to different diameters on the bending instrument 100, and the delamination of the insulating layer 50 is observed after bending to evaluate the insulation of the non-metallic copper-clad laminate. The toughness of layer 50.

[0047] In summary, the method for evaluating the mechanical properties of copper-clad laminates of the p...

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Abstract

The invention provides an assessment method of copper clad laminate mechanical properties, which comprises the following steps: step 1, providing a copper clad laminate to be tested; step 2, manufacturing a sample to be tested, that is, etching the copper foil of the copper clad laminate to be tested, cutting the copper clad laminate with etched copper foil into a sample to be tested with a predetermined dimension; step 3, bending to obtain a predetermined angle by allowing the sample to be tested to surround a cylinder with a predetermined diameter; step 4, observing the laminating condition of the sample to be tested after bending, wherein if no lamination occurs, the sample to be tested accords with testing requirements, if lamination occurs, the sample to be tested does not accord with the testing requirements. The assessment method of copper clad laminate mechanical properties of the invention can simply and rapidly assess whether the mechanical properties to be tested of the copper clad laminate accord with the testing requirements, can rapidly and intuitively characterize the mechanical properties to be tested of the copper clad laminate, such as bonding force and toughness, and improve the assessment method of copper clad laminate mechanical properties.

Description

technical field [0001] The invention relates to an evaluation method, in particular to a method for evaluating the mechanical properties of copper clad laminates. Background technique [0002] With the mass production of electronic information products and the design trend towards light, thin, small, and multi-functional, the printed circuit substrate, which is the main support of electronic components, is also continuously improving its technical level to provide high-density wiring, thin shape, and micro-aperture. , High heat dissipation, under this background, a metal-based copper clad laminate with high heat dissipation was born. The adhesion of metal-based copper-clad laminates is a major indicator affecting its application, including the adhesion between copper foil and the bonding layer, and the bonding between the metal substrate and the bonding layer. For the evaluation of the adhesion between copper foil and the adhesive force, there are clear methods in the prior...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N19/04G01N3/20
Inventor 佘乃东蔡文仁
Owner GUANGDONG SHENGYI SCI TECH
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