Assessment method of copper clad laminate mechanical properties

Abstract

The invention provides an assessment method of copper clad laminate mechanical properties, which comprises the following steps: step 1, providing a copper clad laminate to be tested; step 2, manufacturing a sample to be tested, that is, etching the copper foil of the copper clad laminate to be tested, cutting the copper clad laminate with etched copper foil into a sample to be tested with a predetermined dimension; step 3, bending to obtain a predetermined angle by allowing the sample to be tested to surround a cylinder with a predetermined diameter; step 4, observing the laminating condition of the sample to be tested after bending, wherein if no lamination occurs, the sample to be tested accords with testing requirements, if lamination occurs, the sample to be tested does not accord with the testing requirements. The assessment method of copper clad laminate mechanical properties of the invention can simply and rapidly assess whether the mechanical properties to be tested of the copper clad laminate accord with the testing requirements, can rapidly and intuitively characterize the mechanical properties to be tested of the copper clad laminate, such as bonding force and toughness, and improve the assessment method of copper clad laminate mechanical properties.

Description

Technical field [0001] The invention relates to an evaluation method, in particular to an evaluation method of the mechanical properties of a copper clad laminate. Background technique [0002] With the mass production of electronic information products, and toward the design trend of light, thin, short and multi-functional, printed circuit substrates, which are the main support of electronic components, have also been continuously improved in technology to provide high-density wiring, thin, and fine apertures. , High heat dissipation. Under this background, a metal base copper clad laminate with high heat dissipation was born. The adhesion of metal-based copper clad laminates is a major indicator that affects its application. It includes the adhesion between the copper foil and the adhesive layer, and the adhesion between the metal substrate and the adhesive layer. For the evaluation of the bonding strength of copper foil and copper foil, there are clear methods in the prior ar...

AI Technical Summary

Problems solved by technology

For the evaluation of the adhesion between copper foil and the adhesive force, there are clear methods in the prior art, such as testing the peel strength of copper foil, but this method is not suitable for evaluating the adhesion between the metal substrate and the adhesive layer. For metal substrates There is still no good way to evaluate the adhesion to the adhesive layer

At the same time, the toughness of the insulating layer of the copper clad laminate is an important factor affecting the processability of the PCB, and there is currently no good evaluation method for the toughness of the insulating layer of the copper clad laminate.

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