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Method for preparing copper radiating fins of gradient structures by means of injection forming

A technology of injection molding and copper heat sink, which is applied in the field of powder metallurgy, can solve the problems that the copper heat sink does not fully exert its heat absorption capacity, the quality of copper heat sinks limits the application, and the production process is long, so as to increase the specific surface area of ​​heat dissipation and solve the problem of Thermal resistance problem, the effect of improving efficiency

Active Publication Date: 2014-01-29
GRIMAT ENG INST CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

② Copper heat sinks are mostly prepared by mechanical processing or welding technology, which has long production process, high energy consumption and high cost
The heat absorption capacity of pure copper is higher than that of aluminum, but the specific heat capacity of copper is 0.39J·Kg -1 ·K -1 , the specific heat capacity of aluminum is 0.9J Kg -1 ·K -1 , the aluminum heat sink with the same volume and shape has a stronger heat dissipation capacity than copper, and the copper heat sink prepared by the traditional process does not give full play to its heat absorption capacity.
④The density of copper is 8.9g·cm -3 , the density of aluminum is 2.7g cm -3 , the higher quality of copper heat sinks limits its application in portable computers

Method used

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  • Method for preparing copper radiating fins of gradient structures by means of injection forming
  • Method for preparing copper radiating fins of gradient structures by means of injection forming

Examples

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Effect test

Embodiment 1

[0043]A method of injection molding to prepare copper heat sink with gradient structure, the structure of cylindrical fin heat sink is as follows figure 1 As shown, 1 is the base of the cylindrical fin heat sink, and 2 is the fin of the cylindrical fin heat sink. by figure 1 The heat sink is shown as an example. The gradient structure copper heat sink includes the fin 2 of the heat sink and the base 1 of the heat sink. The preparation process of the heat sink is as follows:

[0044] ⑴The entire heat sink is prepared by metal powder injection molding technology.

[0045] ① The mass fraction of copper powder for fins is: 5% for +80 mesh, 90% for -80 mesh to +100 mesh, and the balance for -100 mesh. The mass fraction of copper powder for base is: -325 mesh to + 400 mesh is 100%, respectively mixed in a double cone mixer for 12 hours. The volume ratio of the two kinds of copper powder to the binder is 55%: 45%, and the binder composition is 70% of paraffin wax, 5% of high-densi...

Embodiment 2

[0052] A method of injection molding to prepare copper heat sink with gradient structure, the structure of cylindrical fin heat sink is as follows figure 1 As shown, the gradient structure copper heat sink includes the fin 2 of the heat sink and the base 1 of the heat sink, and the preparation process of the heat sink is as follows:

[0053] ⑴The entire heat sink is prepared by metal powder injection molding technology.

[0054] ① The mass fraction of copper powder for fins is: 2% for +80 mesh, 95% for -80 mesh to +100 mesh, and the balance for -100 mesh. The mass fraction of copper powder for base is: +325 mesh is 2% %, -325 mesh to +400 mesh is 95%, and -400 mesh is the balance, respectively mixed in a double-cone mixer for 10 hours. The volume ratio of the two kinds of copper powder to the binder is 60%: 40%, and the binder composition is 65% of paraffin wax, 10% of high-density polyethylene, and 20% of polyethylene acetate-ethyl copolymer. %, 5% stearic acid, mix copper ...

Embodiment 3

[0061] A method of injection molding to prepare copper heat sink with gradient structure, the structure of cylindrical fin heat sink is as follows figure 1 As shown, the gradient structure copper heat sink includes the fin 2 of the heat sink and the base 1 of the heat sink, and the preparation process of the heat sink is as follows:

[0062] ⑴The entire heat sink is prepared by metal powder injection molding technology.

[0063] ① The mass fraction of copper powder for fins is: -80 mesh to +100 mesh is 100%, the mass fraction of copper powder for base is: +325 mesh is 5%, -325 mesh to +400 mesh is 90%, - 400 mesh is the remainder, and they are mixed in a double-cone mixer for 10 hours. The volume ratio of the two kinds of copper powder to the binder is 65%: 35%, and the binder composition is 60% of paraffin wax, 10% of high-density polyethylene, and 25% of polyethylene acetate-ethyl copolymer. %, 5% stearic acid, mix copper powder and binder on a high-speed mixer at 90°C for...

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Abstract

The invention discloses a method for preparing copper radiating fins of gradient structures by means of injection forming, which belongs to the technical field of powder metallurgy. The method includes the steps: evenly mixing copper powder of different grain sizes and in different grain size distribution in proportion; respectively mixing the copper powder with paraffin base multi-component binders; forming copper radiating fin green bodies of different gradient structures by means of injection through a double-cavity injection molding machine; obtaining the copper radiating fins of complete structures by means of degreasing and sintering; and finally pressing bases of the copper radiating fins to prepare the copper radiating fins of the gradient structures. The copper radiating fins of the gradient structures prepared by the method are formed once without subsequent machining and are accurate in control and fine in repeatability, the radiating efficiency of the copper radiating fins is 20-50% higher than that of radiating fins with the relative density of 99%, and the copper radiating fins are excellent in radiating performance.

Description

technical field [0001] The invention relates to a method for preparing gradient-structured copper cooling fins by injection molding, and belongs to the technical field of powder metallurgy. Background technique [0002] At present, computer products are gradually developing towards the trend of thinner, smaller, high-functional and high-frequency. The heat (heating density) per unit area is getting higher and higher, and the problem of electronic heat dissipation is becoming more serious and difficult. Relatively Therefore, the difficulty and cost of heat dissipation design are getting higher and higher. The use of heat sinks to increase the heat dissipation area is the most common and basic way in thermal management technology. Although modern new preparation and design technologies are constantly improving, the application of heat sinks seems to be gradually approaching the limit under the limitation of limited space. In the future, various cooling technologies such as he...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B22F3/115B22F3/24
Inventor 罗峥陶海明魏衍广崔雪飞
Owner GRIMAT ENG INST CO LTD
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