Method for realizing copper-copper bonding through current sintering technology and device thereof
A bonding and current technology, applied in electric heating devices, welding equipment, manufacturing tools, etc., can solve the problems of large dispersion of product quality, long sintering time, unfavorable popularization and promotion, etc., to save energy and time, and achieve high density. , the effect of improving the service life
Inactive Publication Date: 2012-07-11
TIANJIN UNIV +1
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Problems solved by technology
However, there are many problems in this method. First, the heating temperature at different stages must be set. Each heating temperature corresponds to a piece of equipment. A lot of equipment is required to complete the sintering. In addition, the pressing stage cannot guarantee that many electronic devices will be pressed at the same time. Each electronic device can be evenly stressed, so the dispersion of product quality is large, and the final heating stage takes a long time, and it takes a long time to complete all sintering, which is time-consuming.
Therefore, the efficiency of this method is not high, and its applicability is limited, which is not conducive to popularization.
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[0023] The present invention sinters the nano-silver solder paste by preheating the components coated with the solder paste and then applying pressure and electricity. Only one heating block and one pressurization and electricity testing machine are needed to complete the sintering.
[0024] use as figure 1 The device shown is composed of a testing machine controller and a pressure-bearing conductive mold; the pressure-bearing conductive mold is composed of an upper loading plate and a lower tray. At the same time, a controllable pulse current can be applied to the mold, and the pulse current passes through both the mold and the sample itself; after sintering, move up and take out the sample.
[0025] The specific steps are as follows figure 2 As shown, the copper device coated with nano-silver solder paste is preheated and placed on the lower tray 5, the controller of the testing machine is turned on to adjust the parameters, so that the upper loading plate 1 moves downward...
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The invention discloses a method for performing copper-copper bonding in an electronic device through a current sintering technology and a device for accomplishing the current sintering method, and belongs to the field of novel sintering technology in power electronic packaging. The method is accomplished through a heating stage and a pressure power-on testing machine, wherein the pressure power-on testing machine can adjust the pressure, the current and the power-on time in a test, and applies pressure and conduction current to a bonding device through a pressure-bearing conducting die. The pressure-bearing conducting die consists of an upper loading plate and a lower tray. A preheated bonding copper device, on which nano-silver paste is coated, is laid on the lower tray, and when the upper loading plate exerts pressure, current is conducted, so that the sintering of the nano-silver paste is realized. The method has the advantages of being high in efficiency, low in cost, convenient in operation and high in bonding strength. The bonding strength of bare copper bonded according to the method reaches 102 MPa, and greatly exceeds that of bare copper bonded according to the existing sintering method.
Description
technical field [0001] The invention relates to a method for bonding copper to copper in electronic devices using current sintering technology, such as the bonding of bus bars to substrates, and realizes bonding electronic devices with sintered nano-silver solder paste by applying pressure and conducting large currents. The new technology area of sintering in power electronics packaging. Background technique [0002] At present, the main method of using sintered nano-silver solder paste to bond electronic devices at home and abroad is pressure sintering. The sintering behavior of nano-silver solder paste is completed through several sections of heat preservation at a certain temperature and pressure during the sintering process. Press two kinds of equipment. However, there are many problems in this method. First, the heating temperature at different stages must be set. Each heating temperature corresponds to a piece of equipment. A lot of equipment is required to complete...
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Login to View More IPC IPC(8): B23K1/00B23K3/00B23K3/04
Inventor 梅云辉陆国权曹云娇陈刚
Owner TIANJIN UNIV