Resin Encapsulation Apparatus And Resin Encapsulation Process

Abstract

The present invention provides a resin encapsulating apparatus which can prevent substrate damage that possibility occurs in demolding between a molded object and a mold and has high yield rate, and a resin encapsulating method. The molded object is formed through encapsulating a semiconductor component which is mounted on the substrate. The resin sealing device is composed of an upper mold assembly and a lower mold assembly. A mold closing mechanism is used for causing vertical movement of a cavity body (63) at a molding position, thereby performing clamping and mold closing on the substrate (1) which is provided with electronic components through the lower surface of the upper mold assembly and the cavity body (63) of the lower mold assembly, so the electronic components of the substrate (1) are immersed into resin encapsulating material (9) which is supplied to a cavity part for performing resin sealing, wherein, the upper mold assembly is provided with a holding mechanism which can hold the substrate (1). The lower mold assembly is provided with the cavity body (63) with the cavity part at an upper surface and can reciprocate between a forming position and a standby position along the base board through a horizontal moving mechanism. Afterwards, frame guiding members (65) are configured on at least two opposite edges in the outer periphery of the cavity body (63), and the frame guiding members (65) are utilized for lifting up the outer peripheral edge of the substrate (1) and demolding.

Description

technical field [0001] The present invention relates to a resin sealing device and a resin sealing method for resin sealing semiconductor devices such as integrated circuits and optical semiconductor elements mounted on at least one surface of a substrate. Background technique [0002] Examples of substrates on which electronic components such as semiconductor elements mounted on the surface are resin-sealed include ceramic substrates made of ceramic materials with excellent heat dissipation properties and mounted with optoelectronic components such as LEDs and semiconductor lasers, power semiconductor elements, and the like. In addition, a resin sealing material is supplied to a cavity provided in a lower mold, the electronic components of the substrate are dipped and resin-sealed, and the resin-sealed molded product is sometimes released from the mold. For example, as in Patent Document 1 figure 1 As shown, the following structure is adopted: the resin sealing material 8 ...

AI Technical Summary

Problems solved by technology

In particular, if a crack occurs in the sealing resin 8 that is a molded product, the semiconductor element 9 or the Au wire 11 that is the object to be sealed may be damaged, and there is a problem that the yield is poor.

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