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Radiating structure

A heat dissipation structure and heat dissipation end technology, applied in lighting and heating equipment, cooling/heating devices of lighting devices, lighting devices, etc., to reduce weight, facilitate design and shape, and reduce costs

Inactive Publication Date: 2012-07-11
陆炜
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the thermal conductivity of this kind of heat dissipation material is not as good as that of copper and aluminum, but with the continuous development of technology, its thermal conductivity will surpass that of metal materials such as copper and aluminum in the future.

Method used

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Examples

Experimental program
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Embodiment 1

[0018] Embodiment one, see figure 1 , a heat dissipation structure, comprising a heat absorption end 6, a heat dissipation end 1, a heat conduction layer 5 is provided on the surface of the heat absorption end 6 and the heat dissipation end 1, a heat dissipation channel 3 is provided between the heat absorption end 6 and the heat dissipation end 1, and the heat dissipation channel The inner wall of 3 is provided with a heat conduction layer 4, and the heat dissipation channel 3 can be designed as a groove or a hole. The heat dissipation channel 3 is filled with a heat conducting material 2 . The heat conducting material 2 and the heat conducting layers 4 and 5 are soft ceramics or heat conducting silica gel. The heat-absorbing end 6 and the heat-dissipating end 1 are made of heat-resistant insulating material, such as plastic, or nylon, or rubber.

Embodiment 2

[0019] Embodiment two, see figure 2 , which is different from Embodiment 1 in that the heat dissipation end is provided with heat dissipation fins 7, 8, and the styles of the fins can be made into various styles according to requirements; the fins 7, 8 are made of heat-resistant insulating materials, such as plastics, or Nylon or rubber; the surface of the fins 7 and 8 is provided with a heat conduction layer 9, and the heat conduction layer 9 is soft ceramic or heat conduction silica gel.

[0020] The above-mentioned embodiments do not use metal materials such as aluminum and copper as heat dissipation materials, but use high thermal conductivity materials such as soft ceramics as heat dissipation materials, and such materials are suitable as coatings, so hard materials are required as radiator skeletons. Considering the skeleton It only plays a supporting role and does not need to participate in heat dissipation. Considering insulation, heat-resistant insulating materials s...

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PUM

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Abstract

The invention discloses a radiating structure, which comprises a heat absorbing end and a radiating end. Heat conducting layers are arranged on surfaces of the heat absorbing end and the radiating end, a radiating channel is disposed between the heat absorbing end and the radiating end, a heat conducting layer is arranged on the inner wall of the radiating channel, and heat conducting materials are filled in the radiating channel. The heat conducting materials and the heat conducting layers are made of flexible ceramic or heat-conducting silica gel. The heat absorbing end and the radiating end are made of heat-resistant insulating materials such as plastics, nylon and rubber. Key problems for reducing heat conduction distances are solved, accordingly, a fin structure identical to that of a traditional radiator can be adopted, and radiating capacity identical to that of the traditional radiator can be realized.

Description

technical field [0001] The invention relates to a novel heat dissipation device based on non-metallic materials, in particular to a heat dissipation structure provided with heat dissipation channels. Background technique [0002] At present, most of the radiators used in electronic products, especially LED lighting products, are based on metal materials with good thermal conductivity such as aluminum and copper. Traditional aluminum and copper radiators are mainly composed of two parts, namely the base section and fin section. The base part absorbs heat and conducts it to the fin part, and the fin ends dissipate heat to the air through radiation and convection. As the heat dissipation requirements of LED lighting products become higher and higher, the volume and weight of the heat dissipation device are also increased, and the corresponding cost is also increased. The disadvantage of metal heat sinks is that the biggest defect of metal materials is electrical conductivity....

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21V29/00F21Y101/02F21V29/71F21V29/74F21V29/83F21V29/85F21Y115/10
Inventor 陆炜
Owner 陆炜
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