39results about How to "Has insulating properties" patented technology

The invention provides a waterproof thermal-insulation coating with organosilicon-modified styrene-acrylic emulsion. The waterproof thermal-insulation coating is prepared from the following componentsin parts by weight: 80-100 parts of organosilicon-modified styrene-acrylic emulsion, 20-25 parts of hollow glass bead, 8-15 parts of diatomite, 5-10 parts of nano titanium dioxide, 30-40 parts of cement, 20-30 parts of talcum powder, 20-30 parts of quartz powder, 0.2-0.5 part of silane coupling agent, 3-6 parts of dispersing agent, 2-4 parts of plasticizer, 0.2-0.5 part of defoaming agent, 1.0-2.5 parts of film-forming additive, 0.1-0.3 part of lubricant, 0.2-0.5 part of preservative and 20-30 parts of deionized water.

Disclosed are an LDMOS (laterally diffused metal oxide semiconductor) transistor and a forming method thereof. The LDMOS transistor comprises a semiconductor substrate, a body region and a drift region, a gate region, a source region, a base region, a drain region, a guide region and a barrier region; the body region and the drift region are located in the semiconductor substrate; the gate region located in the semiconductor substrate crosses the body region and the drift area; the source region and the base region are located in the body region; the drain region is located in the drift region; the guide region located below the body region and the drift region is connected with the body region and the drift region; the doping type of the guide region is opposite to that of the drift region; the barrier region located in the semiconductor region surrounds the body region, the drift region and the guide region; the doping type of the barrier region is opposite to that of the guide region. The LDMOS transistor can prevent leak current from entering the semiconductor substrate, and performance of the LDMOS transistor is improved.

The invention belongs to the technical field of mechanical equipment bearings and particularly relates to a sliding bearing of a motor. The sliding bearing consists of an upper half part and a lower half part and comprises a tile body, tile pads, insulating layers, a sealing ring, insulating pins, insulating sleeves and bolts. The sliding bearing is characterized in that the outer surfaces of the upper half and the lower half of the tile body are respectively provided with the tile pad; the insulating layers are arranged between the tile pads and the tile body, and after the insulating pins are used for positioning, the bolts with the insulating sleeves are adopted for fastening; the inner surface of the tile pad is provided with a water flow channel; and the sealing ring is arranged around the water flow channel. Due to adoption of the scheme, the sliding bearing has the beneficial effects that (1) the structure of a water cavity is simple, the sealing is reliable, and compared with the traditional water-cavity bearing, the contact area of cooling water is large, the cooling effect is good, and special molds do not need to be used for manufacture, so that the production cost is greatly saved; (2) the insulating structure is ingeniously arranged, so that the generation of friction pairs is effectively avoided and the insulating effect is more reliable; and (3) due to combined use of the water cooling function and the insulating function, the bearing of the motor has the insulating characteristic, the bearing capability and the critical speed of rotation are improved, and the use performance is greatly enhanced.

The invention discloses a packaging method for densely arranging semiconductor chips for an Internet of Things terminal, belonging to the field of semiconductor packaging, and a packaging method for densely arranging semiconductor chips for an Internet of Things terminal, including the upper surface of a lower casing There is a placement slot, and two sets of conductive columns are fixedly connected to the upper surface of the lower case, and the two sets of conductive posts are respectively located on both sides of the placement slot, and there are perforations in the lower case, and the perforations are located below the conductive posts. Pins are placed in the center, and the upper ends of the pins are fixedly connected with the conductive columns, the bottom of the placement groove is bonded with adhesive, the chip is placed in the placement groove, and the lower end of the chip is bonded with the adhesive, the upper surface of the chip is It can realize the indirect connection between the chip and the pins by connecting multiple wires to the conductive posts, so as to prevent the pins from being involved in the chip and causing the chip to shake or be damaged. effect without damaging the chip.

The invention discloses an organic nano negative electrode based on an intercalation type pseudocapacitance, which comprises an active material, a conductive agent and a binding agent, and the active material is an organic molecular crystal material. The present invention uses nanometerized organic molecular crystal materials as negative electrode materials for lithium-ion batteries or lithium-ion hybrid capacitors, etc., so that organic nanocrystals can fully contact with the conductive agent in the electrode, have good electronic conductivity, and can significantly improve the performance of lithium-ion batteries. The reversible capacity and energy density of Li-ion hybrid capacitors.

The invention discloses a power cable. The power cable comprises a conductor, wherein an insulation sleeve sleeves an outer wall of the conductor, inner sides of the insulation sleeve and the conductor are filled with magnesium powder, a silica gel sleeve sleeves an outer wall of the insulation sleeve, a bottom groove sleeves the bottom of an outer wall of the silica gel sleeve, a top groove sleeves an outer wall of the top of the silica gel sleeve, the top groove and the silica gel sleeve are in interference fitting, second pull rods are fixedly connected with the bottoms of a left side and aright side of a front surface of the top groove, second connection blocks are fixedly connected with bottoms of a left end and a right end of the top groove, a side block is fixedly connected with anouter side end of each second connection block, a threaded rod is fixedly connected with a center of a bottom end of the side block, an outer wall of the bottom of the threaded rod penetrates througha sleeve block, the sleeve block and the threaded rod are in gap connection, and a threaded sleeve is in threaded connection with the bottom of the outer wall of the threaded rod. In the power cable,the power cable can be protected by matching of the top groove and the bottom groove and by the device when working is needed to be performed, and damage during placement is prevented.

The invention discloses an LED (Light-Emitting Diode) lamp with a heat radiation structure. The LED lamp comprises a lamp head, a power panel, a fixing cover for the power panel, a lamp cup, a light source board, a heat radiator, and a lamp cover or a lens. A plurality of heat radiation fins are distributed around the heat radiator at intervals; openings are arranged at the two ends of the lamp cup; the heat radiator is mounted in the lamp cup; a heat conduction cavity is formed between each two adjacent heat radiation fins and the inner wall of the lamp cup; the light source board is provided with the heat radiator at one opening of the lamp cup; a first air vent is arranged in the lamp cover or the lens; an external diameter of the fixing cover for the power panel is less than an internal diameter of the lamp cup; a second air vent is formed by a gap between the fixing cover for the power panel and the other opening of the lamp cup; one end of each head conduction cavity is vertically communicated with the outside directly through the corresponding first air vent or the light source board and the corresponding first air vent; and the other end of each each heat conduction cavity is vertically communicated with the outside through the second air vent. With the adoption of the structure, a chimney effect is generated, so that the heat radiation properties of the LED lamp are greatly improved.

The invention provides a preparation method of a heating furnace sealing material of a zirconia oxygen analyzer. The preparation method comprises the following steps: (1) preparing a liquid material of the sealing material, wherein the liquid material comprises a waterborne high-temperature insulating coating capable of withstanding a high temperature of 1250 DEG C for a long period of time; (2) preparing a solid material of the sealing material, wherein the solid material comprises sericite powder; and (3) mixing the liquid material with the solid material so as to form the sealing material.The heating furnace sealing material has high-temperature insulation performance, the waterborne high-temperature insulating coating is used as a binder of the heating furnace sealing material, and the sericite powder which is used as a main material can provide water isolation, gas barrier and insulation performance; and the prepared sealing material has good high-temperature stability, no chemical change at high temperature and no large physical change, and has no risk of deformation or cracking at the sealing position due to long-term use at high temperature, so that the service life of a heating furnace is prolonged greatly.