Multiple temperature measurements coupled with modeling
A technology for measuring components and temperature sensors, applied in thermometer testing/calibration, thermometers, measuring heat, etc., can solve problems such as impractical and high-power batteries
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
example 1
[0059] Example 1 - Convection System
[0060]An exemplary system designed as a convection system for increasing the exposure of the second temperature sensor to air from the surrounding environment was tested with a climatic chamber. A chamber enclosing the second temperature sensor is formed with foam rubber insulation to increase heat transfer resistance between the second temperature sensor and the remainder of the system interior space defined by the housing. An opening in the housing is used to allow air flow from the surrounding environment into the chamber and allow warm air close to the second temperature sensor to be displaced. The first temperature sensor is placed on the circuit board, and the interior space within the housing is divided by heat insulating material into two main parts: M1, in which the first temperature sensor, the circuit board and the chamber containing the second temperature sensor are located; and M2 , where a heat source comprising a resisto...
example 2
[0061] Example 2 - System for increasing effective surface contact area with surrounding environment
[0062] A climatic chamber was used to test an exemplary system designed to increase the effective surface contact area between the second temperature sensor and the surrounding environment. The experimental system consisted of a housing with an opening provided with a brass plate having a thickness of about 0.5 mm. A second temperature sensor is mounted on this brass plate, and the sensor / plate structure is enclosed within a chamber defined by thermal insulation. The insulating material defining the chamber is a layer of plastic housing material, ie a layer of plastic of the same type as that used to form the housing. Resistors with external power supply to achieve approximately 1.4W power dissipation are placed within the interior space defined by the housing, enclosing therein the exterior of the chamber of the sensor / board configuration. The heat source was switched on...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More 