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Acoustic transducer incorporating an electromagnetic interference shielding as part of matching layers

An electromagnetic radiation shielding and matching layer technology, which is applied in the direction of sound-emitting devices, instruments, and acoustic wave diagnosis, and can solve problems such as inability to set up, negative impact on image and Doppler signal quality, etc.

Inactive Publication Date: 2012-07-18
GENERAL ELECTRIC CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

This implies that the transducer cannot be set to the maximum sound pressure allowed by the transmission regulations, otherwise it will negatively affect the image and Doppler signal quality

Method used

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  • Acoustic transducer incorporating an electromagnetic interference shielding as part of matching layers
  • Acoustic transducer incorporating an electromagnetic interference shielding as part of matching layers
  • Acoustic transducer incorporating an electromagnetic interference shielding as part of matching layers

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Embodiment Construction

[0044] The following detailed description of certain embodiments of the invention, as well as the foregoing summary, will be better understood when read in conjunction with the accompanying drawings. To illustrate the invention, certain embodiments are shown in the figures. It should be understood, however, that the invention is not limited to the arrangements and instrumentalities shown in the drawings. To the extent that the figures illustrate diagrams of the functional blocks of various embodiments, the functional blocks are not necessarily indicative of the division between hardware circuitry. Thus, for example, one or more of the functional blocks (eg, processor or memory) may be implemented as a single piece of hardware (eg, general purpose signal processor or random access memory, hard disk, etc.). Similarly, a program may be a stand-alone program, incorporated as a subroutine in an operating system, a function in an installed software package, and so on. It should be...

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Abstract

The title of the invention is "acoustic transducer incorporating an electromagnetic interference shielding as part of matching layers". Ultrasound probes (502), and methods of forming probes (502), with electromagnetic shielding and / or improved heat management are provided. Certain probes (502) include an acoustic stack (513) including an active layer (510), a protection face plate or lens (514), and a matching layer (ML1). The matching layer (ML1) includes a mass layer (552) and a spring layer (551). The probe (502) further includes a cable configured to communicate signals to and from the ultrasound probe (502). The probe (502) further includes an electromagnetic radiation shield (508) comprising the mass layer (552). The shield encompasses the active layer (510) and the cable, and is grounded via an electrode (509). The shield is configured to inhibit external electromagnetic radiation from interfering with the signals communicated to and from the ultrasound probe (502) via the cable. Certain probes (502) are configured such that the mass layer (552) is thermally connected to a thermal drain or a heat sink (574) such that heat is conducted away from the protection face plate or lens (514).

Description

[0001] related application [0002] U.S. Application No. 12 / 406,731, entitled "MULTI-LAYERED IMPEDANCE MATCHING STRUCTURE FOR ULTRASOUND PROBE," published September 23, 2010 as U.S. Application Publication No. 2010 / 0237746, It is incorporated herein by reference. [0003] federally funded research or development [0004] [Not applicable] [0005] Microfiche / Copyright Citation [0006] [Not applicable] technical field [0007] Embodiments of the present technology relate generally to ultrasound probes, and more specifically, to electromagnetic shielding of ultrasound probes. Background technique [0008] Ultrasound probes typically have multiple acoustic stacks, each corresponding to an imaging element of the probe. Each acoustic stack has multiple layers attached together in a stacked configuration. The active stack includes at least one electromechanical structure within the stack, such as, for example, a piezoelectric structure formed from a piezoelectric material (e...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): A61B8/00
CPCA61B8/4405G01S15/00A61B8/56A61B8/488A61B8/467A61B8/466A61B8/4427A61B8/4444G10K11/02A61B8/483A61B8/461
Inventor J-F·热利F·兰特里
Owner GENERAL ELECTRIC CO