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Transportation pallet

A technology for pallets and devices, applied in the field of handling pallets, can solve the problems of cumbersome management and the productivity may not be satisfied, and achieve the effect of simplifying management and improving productivity.

Inactive Publication Date: 2012-07-18
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, the plurality of storage rooms provided on the transport tray are divided by partition walls according to the size of the device (chip scale package), so it is necessary to prepare the type of transport tray corresponding to the size of the device, and there is a problem of cumbersome management.
[0007] In addition, it is necessary to transfer the divided devices one by one from the jig to the transfer tray. This transfer process takes time, and it is not necessarily satisfactory in terms of productivity.

Method used

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  • Transportation pallet
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Embodiment Construction

[0043] Hereinafter, preferred embodiment of the conveyance pallet comprised according to this invention is demonstrated in detail, referring drawings.

[0044] figure 1 (a) and (b) show a perspective view and a cross-sectional view of a package substrate as a workpiece. figure 1 The package substrate 1 shown in (a) and (b) includes a metal plate 11, on the surface 11a of the metal plate 11, a plurality of first planned dividing lines 111 extending in a predetermined direction are formed in a grid pattern, and The second planned dividing line 112 extends in a direction perpendicular to the first planned dividing line 111 . Devices (chip scale packages) 113 molded from the back side of the metal plate 11 using the synthetic resin portion 12 are respectively arranged in a plurality of regions divided by the first planned dividing line 111 and the second planned dividing line 112. . The package substrate 1 thus formed is cut along the first planned dividing line 111 and the sec...

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PUM

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Abstract

The invention provides a transportation pallet capable of handing parts from a clamp thereto efficiently. The transportation pallet accommodates a plurality of parts and handles the parts, which comprises a pallet body consisting of a part supporting member and a frame member, and an adhesion layer. The part supporting member is provided with a surface for supporting the plurality of parts. The frame member surrounds the outer circumference of the part supporting member. The adhesion layer provides an adhesive force and is arranged on the surface of the part supporting member of the pallet body.

Description

technical field [0001] The present invention relates to a conveyance tray for accommodating and conveying semiconductor devices divided by a dicing device such as a cutting device. Background technique [0002] In the semiconductor device manufacturing process, devices such as IC (Integrated Circuit, integrated circuit) and LSI (Large Scale Integration, large-scale integrated circuit) are formed on the surface of a roughly disc-shaped semiconductor wafer in a plurality of regions arranged in a grid pattern, Individual devices are produced by cutting along planned dividing lines that divide the respective regions for forming the devices. Devices thus divided are packaged and widely used in electrical equipment such as portable phones and personal computers. [0003] Electric equipment such as mobile phones and personal computers are required to be more lightweight and miniaturized, and a packaging technology that can achieve miniaturization called Chip Scale Package (CSP, Ch...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65D71/70H01L21/677H01L21/673
Inventor 关家一马
Owner DISCO CORP