Crucible capable of improving utilization rate of silicon ingot and using frequency of seed crystal and preparation method of crucible
A utilization rate and crucible technology is applied in the field of crucibles and their preparation for improving the utilization rate of silicon ingots and the use times of seed crystals, and can solve the problem of long low minority carrier life area of silicon ingots, the influence of repeated use times of seed crystals, and reduced minority carrier life of silicon ingots. and other problems, to achieve the effect of improving the quality and utilization rate of silicon ingots, improving the utilization rate of silicon ingots, and improving the utilization rate of seed crystals.
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Embodiment 1
[0027] Such as figure 1 As shown, a crucible 100 for improving the utilization rate of silicon ingots and the number of times of use of seed crystals includes a body 10 , a silicon nitride layer 20 and a high-purity isolation layer 30 . The body 10 includes a base and side walls extending upward from the base, the base and the side walls jointly enclose a storage space, the silicon nitride layer 20 is attached to the body base and side walls facing the storage space, and the isolation layer 30 is attached to the nitride On the silicon layer 20 , facing the base of the main body in the receiving space.
[0028] Take a quartz crucible sprayed with a silicon nitride layer, and set a quartz glass sheet with a thickness of 1mm on the silicon nitride layer at the base of the crucible body as an isolation layer. The quartz purity of the quartz glass sheet is 99.99%. Then lay the seed crystal 40 on the isolation layer, and install the prepared raw material 50 on the seed crystal 40 f...
Embodiment 2
[0031] A crucible for improving the utilization rate of silicon ingots and the number of times of use of seed crystals, the structure is the same as that of the first embodiment, the difference is that the set isolation layer is a silicon nitride film with a thickness of 100nm, and the density of the film is 99.9%. The purity of silicon oxide is 99.99%, and the silicon nitride film is deposited by plasma enhanced chemical vapor deposition (PECVD).
[0032] Wherein, the deposition conditions are as follows: a deposition temperature of 350° C., a process pressure of 2.6 Torr, a gas flow rate of silane of 480 sccm, and a gas flow rate of ammonia gas of 3800 sccm.
Embodiment 3
[0034] A crucible for improving the utilization rate of silicon ingots and the number of times of use of seed crystals, the structure is the same as that of the first embodiment, the difference lies in that the isolation layer is made of quartz glass sheet and silicon nitride film.
[0035] Take a quartz crucible that has been sprayed with a silicon nitride layer, lay a layer of quartz glass sheet with a thickness of 1mm and a purity of 99.90% on the silicon nitride layer at the base of the crucible body, and then use plasma enhanced chemical vapor deposition (PECVD) A layer of silicon nitride film is deposited on the quartz glass sheet, the thickness of the silicon nitride film is 100nm, the density is 99.9%, and the purity of the silicon nitride is 99.99%.
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