Double-layer fin-type three-dimensional LED (Light Emitting Diode) heat radiator
A LED heat sink, three-dimensional technology, applied in semiconductor devices of light-emitting elements, lighting and heating equipment, cooling/heating devices of lighting devices, etc., can solve problems such as heat conduction of difficult LED chips, and reduce junction temperature , stable performance and high heat dissipation efficiency
Inactive Publication Date: 2012-07-18
SHAANXI TANGHUA ENERGY
View PDF5 Cites 5 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
In this way, it is more difficult to conduct the heat of the LED chip through the heat sink more effectively.
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0020] The present invention will be described in detail below in combination with specific embodiments.
[0021] A double-layer fin-type three-dimensional LED heat sink according to the present invention is provided with two layers of thin-plate-shaped heat sinks, and the upper surface of the upper heat sink 1 and the lower surface of the lower heat sink 3 are both provided with arrayed fins Shaped protrusion; between the upper heat sink 1 and the lower heat sink 3, there is a sheet-like heat conduction sheet 4; the integrated LED chip 5 is embedded in the thin plate of the lower heat sink 3. The section of the fin-shaped protrusion is rectangular or triangular. The fin-shaped protrusions of the upper heat sink 1 are higher than the fin-shaped protrusions of the lower heat sink 3 . Edges at both ends of the heat conducting sheet 4 are sealed with heat conducting glue 2 . The double-fin type heat sink has a large heat dissipation area. All heat sinks 1 are made of 1060 pure ...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention relates to a double-layer fin-type three-dimensional LED (Light Emitting Diode) heat radiator. In the traditional heat radiator structure for high-power LED lamps, chips are mounted below the heat radiator. The effective radiation basically depends on the superficial area of the heat radiator. The heat radiator is provided with two layers of laminated radiating fins; both the upper surface of the upper-layer radiating fin and the lower surface of the lower-layer radiating fin are provided with fin-type protuberances of arrays; a laminated heat conducting fin is clamped between the upper-layer radiating fin and the lower-layer radiating fin; an integrated LED chip is inlayed in a thin plate of the lower-layer radiating fin; the cross section of the fin-type protuberance is rectangular or triangular; the fin-type protuberance of the upper-layer radiating fin is higher than the fin-type protuberance of the lower-layer radiating fin; and the edges at both ends of the heat conducting fin are sealed by a sealing heat conducting adhesive. According to the invention, the three-dimensional double-layer fin-type radiating fin is adopted, so as to increase the radiating area of the LED chip; and a heat conducting fin is set so that the radiating efficiency is improved, so as to effectively prolong the service life of the LED lamp.
Description
technical field [0001] The invention belongs to the technical field of LED lamps, and in particular relates to a double-fin type three-dimensional LED radiator. Background technique [0002] As a new generation of green and environmentally friendly solid-state lighting source, light-emitting diode LED has a series of advantages such as low power consumption, pure light color, all solid state, light weight, small size, and environmental protection. When the LED emits light, part of the energy will be converted into heat, which will increase the temperature of the LED chip. The temperature has a great influence on the working performance of the LED chip. High temperature will lead to the reduction of photons emitted by the chip, the decrease of color temperature quality, the acceleration of chip aging, and the shortening of device life and other serious consequences. Therefore, in order to ensure the normal operation of the LED, the heat emitted by it must be dissipated in t...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): F21V29/00F21Y101/02F21V29/76F21Y115/10
Inventor 胡民浩高辉
Owner SHAANXI TANGHUA ENERGY